--- In kicad-users@yahoogroups.com, Robert [EMAIL PROTECTED] wrote:
It sounds like we're doing something different here, Igor, in that the
device will be placed by machine and reflow soldered. However, even
using these methods the industry hasn't settled upon a good design, so I
would be
Thank you - that's useful. I see you broke up the thermal pad with the
solder mask, which is as recommended. Do you know how to do that with
kicad? I tried creating a zone on the mask layer, but it didn't work.
I've therefore gone for creating an array of dummy pins (ie 33
onwards), all
Hi,
I do not know this footprint, but when I need a zone in the midle of a
footprint, I also create a row of square pins all of them with number 0
(zero). So I have only one pin with number 0 in the Eeschema component.
If you create a single big pad or a zone in the module, the component wil
--- In kicad-users@yahoogroups.com, Robert [EMAIL PROTECTED]
wrote:
Does anyone have a tried and tested Kicad footprint for a 32 pin MLF
package (as used by the Atmel Mega88) that they could let me have,
please? Atmel just offer general guidance (since the MLF is a new
package and the
I assume you are refering to the drawing 32M1-A on page 355 of the
That's the one.
datasheet? Why did you choose this package when a 28 pin DIP and a
TQFP seems to be an option.
Because the other two packages are much bigger, and this one fits the
available space :).
Regards,
Robert.
Hello Robert!
Does anyone have a tried and tested Kicad footprint for a 32 pin MLF
package (as used by the Atmel Mega88) that they could let me have,
please? Atmel just offer general guidance (since the MLF is a new
package and the industry guidelines have not been developed yet for a
PCB
