On 14-04-2013 21:44, Zhang Rui wrote:
On Fri, 2013-04-05 at 08:32 -0400, Eduardo Valentin wrote:
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation
On 14-04-2013 21:44, Zhang Rui wrote:
On Fri, 2013-04-05 at 08:32 -0400, Eduardo Valentin wrote:
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation
On Fri, 2013-04-05 at 08:32 -0400, Eduardo Valentin wrote:
> For boards that provide a PCB sensor close to SoC junction
> temperature, it is possible to remove the cumulative heat
> reported by the SoC temperature sensor.
>
> This patch changes the extrapolation computation to consider
> an
On Fri, 2013-04-05 at 08:32 -0400, Eduardo Valentin wrote:
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation computation to consider
an external
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.
Signed-off-by: Eduardo
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.
This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.
Signed-off-by: Eduardo
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