Re: [PATCH 2/3] hwmon: Driver for OMAP3 temperature sensor

2014-12-28 Thread Guenter Roeck
On Sat, Dec 27, 2014 at 11:35:16PM +0100, Pavel Machek wrote: On Sat 2014-12-27 20:58:25, Pavel Machek wrote: On Fri 2014-12-26 13:34:53, Sebastian Reichel wrote: OMAP34xx and OMAP36xx processors contain a register in the syscon area, which can be used to determine the SoCs temperature.

Re: [PATCH 2/3] hwmon: Driver for OMAP3 temperature sensor

2014-12-28 Thread Sebastian Reichel
On Sun, Dec 28, 2014 at 12:24:47AM -0800, Guenter Roeck wrote: On Sat, Dec 27, 2014 at 11:35:16PM +0100, Pavel Machek wrote: On Sat 2014-12-27 20:58:25, Pavel Machek wrote: On Fri 2014-12-26 13:34:53, Sebastian Reichel wrote: OMAP34xx and OMAP36xx processors contain a register in the

Re: [PATCH v10 2/8] ARM: l2c: Refactor the driver to use commit-like interface

2014-12-28 Thread Tomasz Figa
Nishanth, Tony, On 24.12.2014 02:13, Nishanth Menon wrote: On 12/23/2014 11:06 AM, Tony Lindgren wrote: * Marek Szyprowski m.szyprow...@samsung.com [141223 02:51]: From: Tomasz Figa t.f...@samsung.com Certain implementations of secure hypervisors (namely the one found on Samsung Exynos-based

[PATCH] ARM: dts: cm-t3x: add NAND support

2014-12-28 Thread Dmitry Lifshitz
Add NAND support Signed-off-by: Dmitry Lifshitz lifsh...@compulab.co.il --- arch/arm/boot/dts/omap3-cm-t3x.dtsi | 58 + arch/arm/boot/dts/omap3-sbc-t3517.dts |4 ++ arch/arm/boot/dts/omap3-sbc-t3530.dts | 10 ++ arch/arm/boot/dts/omap3-sbc-t3730.dts

Re: [PATCH] ARM: dts: cm-t3x: add NAND support

2014-12-28 Thread Igor Grinberg
Hi Dima, On 12/28/14 15:15, Dmitry Lifshitz wrote: Add NAND support Signed-off-by: Dmitry Lifshitz lifsh...@compulab.co.il --- arch/arm/boot/dts/omap3-cm-t3x.dtsi | 58 + arch/arm/boot/dts/omap3-sbc-t3517.dts |4 ++

[PATCH v2] ARM: dts: cm-t3x: add NAND support

2014-12-28 Thread Dmitry Lifshitz
CM-T3517, CM-T3530 and CM-T3730 features NAND storage chip connected to GPMC bus. Add GPMC DT entry into the root DT file omap3-cm-t3x.dtsi, common for all three modules. NAND timings are calculated to be safe for CM-T3x devices as it works now in non DT boot (in this case the timings are

Re: [PATCH v2] ARM: dts: cm-t3x: add NAND support

2014-12-28 Thread Igor Grinberg
On 12/28/14 16:30, Dmitry Lifshitz wrote: CM-T3517, CM-T3530 and CM-T3730 features NAND storage chip connected to GPMC bus. Add GPMC DT entry into the root DT file omap3-cm-t3x.dtsi, common for all three modules. NAND timings are calculated to be safe for CM-T3x devices as it works now

Re: [PATCH 3/7] mfd: menelaus: add initial DT support

2014-12-28 Thread Aaro Koskinen
Hi, On Sat, Dec 27, 2014 at 03:25:53PM -0600, Felipe Balbi wrote: On Sat, Dec 27, 2014 at 07:52:55PM +0200, Aaro Koskinen wrote: Add initial DT support. Signed-off-by: Aaro Koskinen aaro.koski...@iki.fi --- Documentation/devicetree/bindings/mfd/menelaus.txt | 30 +

Re: [PATCH 1/4] usb: dwc3: gadget: Fix TRB preparation during SG

2014-12-28 Thread Amit Virdi
On Sat, Dec 27, 2014 at 11:14 PM, Felipe Balbi ba...@ti.com wrote: Hi, On Sat, Dec 27, 2014 at 12:39:23PM +0530, Amit Virdi wrote: On Mon, Dec 22, 2014 at 9:34 PM, Felipe Balbi ba...@ti.com wrote: On Fri, Dec 19, 2014 at 12:40:15PM +0530, Amit Virdi wrote: When scatter gather is used,

Re: [PATCH 2/4] usb: dwc3: gadget: Stop TRB preparation after limit is reached

2014-12-28 Thread Amit Virdi
On Sat, Dec 27, 2014 at 11:16 PM, Felipe Balbi ba...@ti.com wrote: Hi, On Sat, Dec 27, 2014 at 01:24:03PM +0530, Amit Virdi wrote: On Mon, Dec 22, 2014 at 9:36 PM, Felipe Balbi ba...@ti.com wrote: On Fri, Dec 19, 2014 at 12:40:16PM +0530, Amit Virdi wrote: When SG is used, there are two