This movement is needed because the hwmon entries and corresponding
sysfs interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit
This patch inserts exynos5 TMU sensor changes in the thermal driver.
Some exynos4 changes are made generic for exynos series.
Signed-off-by: SangWook Ju sw...@samsung.com
Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org
---
drivers/thermal/Kconfig |6 +-
Again the series of small moves of common code from the plat-s3c24xx to the
mach-s3c24xx directory.
This time without the wrong handled irq.c . Hopefully I'll get time to do it
properly later.
As the dev-uart.c move breaks the resource patch by Tushar Behera, I updated
the patch to fix the
Following the model of s3c64xx cpu.c becomes common.c in mach-s3c24xx,
to got more common code added later on.
Signed-off-by: Heiko Stuebner he...@sntech.de
---
arch/arm/mach-s3c24xx/Makefile |2 ++
.../{plat-s3c24xx/cpu.c = mach-s3c24xx/common.c} |2 +-
The uart devices are used on all s3c24xx machines, so they can reside
in the common code for all machines.
Signed-off-by: Heiko Stuebner he...@sntech.de
---
arch/arm/mach-s3c24xx/common.c | 73 +++
arch/arm/plat-s3c24xx/Makefile |1 -
This is the basic power-management code used by all s3c24xx machines.
Signed-off-by: Heiko Stuebner he...@sntech.de
---
arch/arm/mach-s3c24xx/Makefile |4
arch/arm/{plat-s3c24xx = mach-s3c24xx}/irq-pm.c |0
arch/arm/{plat-s3c24xx = mach-s3c24xx}/pm.c |0
Signed-off-by: Heiko Stuebner he...@sntech.de
---
arch/arm/mach-s3c24xx/common.c | 18
arch/arm/plat-s3c24xx/Makefile |1 -
arch/arm/plat-s3c24xx/clock.c | 59
3 files changed, 18 insertions(+), 60 deletions(-)
delete mode 100644
From: Tushar Behera tushar.beh...@linaro.org
CC: Ben Dooks ben-li...@fluff.org
CC: Kukjin Kim kgene@samsung.com
Signed-off-by: Tushar Behera tushar.beh...@linaro.org
Signed-off-by: Heiko Stuebner he...@sntech.de
---
changes since v1: update the patch to apply against the moved dev-uart
Hi, Amit,
Sorry for the late response as I'm in a travel recently.
I think the generic cpufreq cooling patches are good.
But about the THERMAL_TRIP_STATE_INSTANCE patch, what I'd like to see is that
1. from thermal zone point of view, when the temperature is higher than a trip
point, either
On Tue, 8 May 2012 21:48:12 +0530
Amit Daniel Kachhap amit.kach...@linaro.org wrote:
This patchset introduces a new generic cooling device based on cpufreq that
can be used on non-ACPI platforms. As a proof of concept, we have drivers for
the following platforms using this mechanism now:
On Tue, 8 May 2012 21:48:15 +0530
Amit Daniel Kachhap amit.kach...@linaro.org wrote:
This movement is needed because the hwmon entries and corresponding
sysfs interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and
On Tue, 8 May 2012 21:48:17 +0530
Amit Daniel Kachhap amit.kach...@linaro.org wrote:
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic
On Tue, 8 May 2012 21:48:18 +0530
Amit Daniel Kachhap amit.kach...@linaro.org wrote:
This patch adds necessary default platform data support needed for TMU driver.
This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms.
...
---
This patch series adds device tree based discovery support for Samsung's
s3c64xx compatible spi controller. This is mainly tested for Exynos4210
and Exynos5250 with onboard spi nor flash device.
This patch series is based on Linux 3.4-rc5 with the following two
patch series applied.
[1]
The macro S3C64XX_SPI_ST_TRLCNTZ is not used and hence it is removed.
Cc: Jaswinder Singh jaswinder.si...@linaro.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
drivers/spi/spi-s3c64xx.c |4
1 files changed, 0 insertions(+), 4 deletions(-)
diff --git
Platform data is used to specify controller hardware specific information
such as the tx/rx fifo level mask and bit offset of rx fifo level. Such
information is not suitable to be supplied from device tree. Instead,
it can be moved into the driver data and removed from platform data.
Cc:
With the spi hardware controller information moved to spi driver data,
this information can be removed from the spi platform data.
Cc: Jaswinder Singh jaswinder.si...@linaro.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
arch/arm/mach-exynos/setup-spi.c | 25
The platform data pointer that is passed to the spi gpio setup functions
is not used. Hence, this paremeter is removed from all the spi gpio setup
functions.
Cc: Jaswinder Singh jaswinder.si...@linaro.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
With the addition of platform specific driver data in the spi-s3c64xx
driver, the device name of spi controllers are changed. Accordingly,
update the device name of spi clocks instances.
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
arch/arm/mach-exynos/clock-exynos4.c | 18
With the spi controller hardware configuration moved into the driver data, there
are no more default hardware configuration data that is passed through platform
data. Accordingly, the s3c64xx_spi{0|1|2}_set_platdata functions are adapted to
these changes.
Cc: Jaswinder Singh
The set_level callback in the controller data, which is used to configure
the slave select line, cannot be supported when migrating the driver to
device tree based discovery. Since all the platforms currently use gpio
as the slave select line, this callback can be removed from the
controller data
The sclk_spi clock is derived currently from the first level divider
(MMCx_RATIO) which is incorrect. The output of the first level clock
is divided by a second level divider (MMCx_PRE_RATIO), the output of
which is used as the spi bus clock (sclk_spi). Fix the clock hierarchy
issues for the
Add support for clock instances for each spi controller.
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
arch/arm/mach-exynos/clock-exynos5.c | 98
arch/arm/mach-exynos/include/mach/regs-clock.h |4 +
2 files changed, 102 insertions(+), 0
Add support for device based discovery.
Cc: Jaswinder Singh jaswinder.si...@linaro.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
.../devicetree/bindings/spi/spi-samsung.txt| 113
drivers/spi/spi-s3c64xx.c | 277 +---
2
Winbond W25Q80BW is a 8Mbit serial flash memory device.
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
drivers/mtd/devices/m25p80.c |1 +
1 files changed, 1 insertions(+), 0 deletions(-)
diff --git a/drivers/mtd/devices/m25p80.c b/drivers/mtd/devices/m25p80.c
index
On 05/08/2012 07:42 AM, Kukjin Kim wrote:
Sylwester Nawrocki wrote:
Add the gate clocks and register region address definition for
FIMC-LITE devices available in Exynos4x12 and Exynos5 SoCs.
This is right description? I can't find your changes for EXYNOS4412 and
EXYNOS5 here. Only this is
On 05/08/2012 09:35 AM, Sylwester Nawrocki wrote:
On 05/08/2012 07:42 AM, Kukjin Kim wrote:
Sylwester Nawrocki wrote:
Add the gate clocks and register region address definition for
FIMC-LITE devices available in Exynos4x12 and Exynos5 SoCs.
This is right description? I can't find your
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
Signed-off-by: Amit Daniel Kachhap
This patch adds necessary default platform data support needed for TMU driver.
This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms.
Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org
---
drivers/thermal/exynos_thermal.c | 107
This patch adds support for generic cpu thermal cooling low level
implementations using frequency scaling up/down based on the registration
parameters. Different cpu related cooling devices can be registered by the
user and the binding of these cooling devices to the corresponding
trip points can
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