Re: [PATCH] mmc: sdhci-s3c: Add device tree support
On 08/16/2012 10:05 PM, Thomas Abraham wrote:
Add device tree based discovery support for Samsung's sdhci controller
Cc: Ben Dooks ben-li...@fluff.org
Cc: Kukjin Kim kgene@samsung.com
Cc: Chris Ball c...@laptop.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
Changes since v3:
The patch series that adds device tree support for Samsung sdhci controller
had six patches in total, of which, the first five patches have been accepted.
The sixth patch in the series was dropped since it was using custom Samsung
properties for descrbing the bus-width and card-detect gpio, but had otherwise
addressed all the comments.
This patch reworks the sixth patch in v3 of the sdhci device tree support
patch series. The only change in this patch from the v3 version is the use of
generic mmc bindings for descrbing the bus-width and card-detect gpio.
.../devicetree/bindings/mmc/samsung-sdhci.txt | 51 +++
drivers/mmc/host/sdhci-s3c.c | 146
+++-
2 files changed, 191 insertions(+), 6 deletions(-)
create mode 100644 Documentation/devicetree/bindings/mmc/samsung-sdhci.txt
diff --git a/Documentation/devicetree/bindings/mmc/samsung-sdhci.txt
b/Documentation/devicetree/bindings/mmc/samsung-sdhci.txt
new file mode 100644
index 000..398540b
--- /dev/null
+++ b/Documentation/devicetree/bindings/mmc/samsung-sdhci.txt
@@ -0,0 +1,51 @@
+* Samsung's SDHCI Controller device tree bindings
+
+Samsung's SDHCI controller is used as a connectivity interface with external
+MMC, SD and eMMC storage mediums. This file documents differences between the
+core mmc properties described by mmc.txt and the properties used by the
+Samsung implmentation of the SDHCI controller.
+
+Required SoC Specific Properties:
+- compatible: should be one of the following
+ - samsung,s3c6410-sdhci: For controllers compatible with s3c6410 sdhci
+controller.
+ - samsung,exynos4210-sdhci: For controllers compatible with Exynos4 sdhci
+controller.
+
+Required Board Specific Properties:
+- gpios: Should specify the gpios used for clock, command and data lines. The
+ gpio specifier format depends on the gpio controller.
+
+Optional Board Specific Properties:
+- One of the following properties for card detect type.
+ - samsung,sdhci-cd-internal: Card detect line from the card slot is
+connected to the card detect pad of the sdhci controller. A gpio is
+used for this connection (with possible pin function settings).
+ - samsung,sdhci-cd-gpio: A gpio line (with possible pin function settings)
+is used a card detect line. This gpio line is not connected to card
detect
+pad of the sdhci controller.
+ - samsung,sdhci-cd-none: There is no card detect line. Polling is used to
+detect the presence of the card. (DEFAULT, if no card detect property
+is specified).
+ - samsung,sdhci-cd-permanent: There is no card detect line. The card is
+permanently connected to the sdhci controller.
+
+Example:
+ sdhci@1253 {
+ compatible = samsung,exynos4210-sdhci;
+ reg = 0x1253 0x100;
+ interrupts = 0 75 0;
Typo: interrupts = 0 75 0;
+ bus-width = 4;
+ samsung,sdhci-cd-internal;
+ cd-gpios = gpk2 2 2 3 3;
+ gpios = gpk2 0 2 0 3, /* clock line */
+ gpk2 1 2 0 3, /* command line */
+ gpk2 3 2 3 3, /* data line 0 */
+ gpk2 4 2 3 3, /* data line 1 */
+ gpk2 5 2 3 3, /* data line 2 */
+ gpk2 6 2 3 3; /* data line 3 */
+ };
+
+ Note: This example shows both SoC specific and board specific properties
+ in a single device node. The properties can be actually be seperated
+ into SoC specific node and board specific node.
diff --git a/drivers/mmc/host/sdhci-s3c.c b/drivers/mmc/host/sdhci-s3c.c
index a50c205..7fcc642 100644
--- a/drivers/mmc/host/sdhci-s3c.c
+++ b/drivers/mmc/host/sdhci-s3c.c
@@ -34,6 +34,9 @@
#define MAX_BUS_CLK (4)
+/* Number of gpio's used is max data bus width + command and clock lines */
+#define NUM_GPIOS(x) (x + 2)
+
/**
* struct sdhci_s3c - S3C SDHCI instance
* @host: The SDHCI host created
@@ -41,6 +44,7 @@
* @ioarea: The resource created when we claimed the IO area.
* @pdata: The platform data for this controller.
* @cur_clk: The index of the current bus clock.
+ * @gpios: List of gpio numbers parsed from device tree.
* @clk_io: The clock for the internal bus interface.
* @clk_bus: The clocks that are available for the SD/MMC bus clock.
*/
@@ -52,6 +56,7 @@ struct sdhci_s3c {
unsigned intcur_clk;
int ext_cd_irq;
int ext_cd_gpio;
+ int *gpios;
struct clk *clk_io;
struct clk
Re: [PATCH v6 1/6] thermal: add generic cpufreq cooling implementation
On 四, 2012-08-16 at 17:11 +0530, Amit Daniel Kachhap wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 52 +++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 512 + include/linux/cpu_cooling.h | 79 + 5 files changed, 655 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..a1f2a6b --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,52 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple instances of cpufreq +cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + +This interface function unregisters the thermal-cpufreq-%x cooling
Re: [PATCH v6 1/6] thermal: add generic cpufreq cooling implementation
On 17 August 2012 12:54, Zhang Rui rui.zh...@intel.com wrote: On 四, 2012-08-16 at 17:11 +0530, Amit Daniel Kachhap wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 52 +++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 512 + include/linux/cpu_cooling.h | 79 + 5 files changed, 655 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..a1f2a6b --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,52 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple instances of cpufreq +cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + +This interface
Re: [PATCH] mmc: sdhci-s3c: Add device tree support
Hi Thomas,
Am Donnerstag, 16. August 2012, 17:49:29 schrieb Thomas Abraham:
Add device tree based discovery support for Samsung's sdhci controller
Cc: Ben Dooks ben-li...@fluff.org
Cc: Kukjin Kim kgene@samsung.com
Cc: Chris Ball c...@laptop.org
Signed-off-by: Thomas Abraham thomas.abra...@linaro.org
---
drivers/mmc/host/sdhci-s3c.c | 146
-- 1 files changed, 140
insertions(+), 6 deletions(-)
diff --git a/drivers/mmc/host/sdhci-s3c.c b/drivers/mmc/host/sdhci-s3c.c
index a50c205..7fcc642 100644
--- a/drivers/mmc/host/sdhci-s3c.c
+++ b/drivers/mmc/host/sdhci-s3c.c
[...]
@@ -737,6 +860,16 @@ static struct platform_device_id
sdhci_s3c_driver_ids[] = { };
MODULE_DEVICE_TABLE(platform, sdhci_s3c_driver_ids);
+#ifdef CONFIG_OF
+static const struct of_device_id sdhci_s3c_dt_match[] = {
+ { .compatible = samsung,s3c6410-sdhci, },
+ { .compatible = samsung,exynos4210-sdhci,
+ .data = exynos4_sdhci_drv_data },
Please use the EXYNOS4_SDHCI_DRV_DATA constant here. Otherwise other Samsung
platforms experimenting with dt will break.
Thanks
Heiko
--
To unsubscribe from this list: send the line unsubscribe linux-samsung-soc in
the body of a message to majord...@vger.kernel.org
More majordomo info at http://vger.kernel.org/majordomo-info.html
Re: [PATCH v6 1/6] thermal: add generic cpufreq cooling implementation
Hello, On Fri, Aug 17, 2012 at 10:58 AM, Amit Kachhap amit.kach...@linaro.org wrote: On 17 August 2012 12:54, Zhang Rui rui.zh...@intel.com wrote: On 四, 2012-08-16 at 17:11 +0530, Amit Daniel Kachhap wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 52 +++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 512 + include/linux/cpu_cooling.h | 79 + 5 files changed, 655 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..a1f2a6b --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,52 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple instances of cpufreq +cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 void
[RESEND PATCH v6 1/6] thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) * Omap platforms in drivers/staging/omap-thermal/ There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale and omap platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- About this patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Reviewed-by: Eduardo Valentin eduardo.valen...@ti.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 52 +++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 586 + include/linux/cpu_cooling.h | 79 5 files changed, 729 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..a1f2a6b --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,52 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple instances of cpufreq +cooling devices. + + clip_cpus: cpumask of cpus where the frequency constraints will happen. + +1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) + +This interface function unregisters the thermal-cpufreq-%x cooling device. + +cdev: Cooling device pointer which has to be unregistered. + + +1.2 CPU cooling action notifier register/unregister
Re: [RESEND PATCH v6 1/6] thermal: add generic cpufreq cooling implementation
This is repost containing the changes suggested by Zhang Rui. Now the cpufreq current state will be calculated each time instead of earlier way of returning the cached value. Thanks, Amit Daniel On 17 August 2012 18:59, Amit Daniel Kachhap amit.kach...@linaro.org wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) * Omap platforms in drivers/staging/omap-thermal/ There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale and omap platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- About this patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Cc: Kyungmin Park kmp...@infradead.org Cc: Kukjin Kim kgene@samsung.com Reviewed-by: Eduardo Valentin eduardo.valen...@ti.com Signed-off-by: Andrew Morton a...@linux-foundation.org Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com --- Documentation/thermal/cpu-cooling-api.txt | 52 +++ drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |1 + drivers/thermal/cpu_cooling.c | 586 + include/linux/cpu_cooling.h | 79 5 files changed, 729 insertions(+), 0 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..a1f2a6b --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,52 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping) provides registration/unregistration APIs +to the caller. The binding of the cooling devices to the trip point is left for +the user. The registration APIs returns the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct cpumask *clip_cpus) + +This interface function registers the cpufreq cooling device with the name +thermal-cpufreq-%x. This api can support multiple instances of cpufreq +cooling
