Winbond W25Q80BW is a 8Mbit serial flash memory device.
Signed-off-by: Thomas Abraham
---
drivers/mtd/devices/m25p80.c |1 +
1 files changed, 1 insertions(+), 0 deletions(-)
diff --git a/drivers/mtd/devices/m25p80.c b/drivers/mtd/devices/m25p80.c
index 1924d24..dbd44b1 100644
--- a/drivers/
Add support for device based discovery.
Cc: Jaswinder Singh
Signed-off-by: Thomas Abraham
---
.../devicetree/bindings/spi/spi-samsung.txt| 113
drivers/spi/spi-s3c64xx.c | 277 +---
2 files changed, 358 insertions(+), 32 deletions(-)
Add support for clock instances for each spi controller.
Signed-off-by: Thomas Abraham
---
arch/arm/mach-exynos/clock-exynos5.c | 98
arch/arm/mach-exynos/include/mach/regs-clock.h |4 +
2 files changed, 102 insertions(+), 0 deletions(-)
diff --git a/arc
The sclk_spi clock is derived currently from the first level divider
(MMCx_RATIO) which is incorrect. The output of the first level clock
is divided by a second level divider (MMCx_PRE_RATIO), the output of
which is used as the spi bus clock (sclk_spi). Fix the clock hierarchy
issues for the sclk_s
The set_level callback in the controller data, which is used to configure
the slave select line, cannot be supported when migrating the driver to
device tree based discovery. Since all the platforms currently use gpio
as the slave select line, this callback can be removed from the
controller data a
With the spi controller hardware configuration moved into the driver data, there
are no more default hardware configuration data that is passed through platform
data. Accordingly, the s3c64xx_spi{0|1|2}_set_platdata functions are adapted to
these changes.
Cc: Jaswinder Singh
Signed-off-by: Thomas
With the addition of platform specific driver data in the spi-s3c64xx
driver, the device name of spi controllers are changed. Accordingly,
update the device name of spi clocks instances.
Signed-off-by: Thomas Abraham
---
arch/arm/mach-exynos/clock-exynos4.c | 18 +-
arch/arm/
The platform data pointer that is passed to the spi gpio setup functions
is not used. Hence, this paremeter is removed from all the spi gpio setup
functions.
Cc: Jaswinder Singh
Signed-off-by: Thomas Abraham
---
arch/arm/mach-exynos/setup-spi.c |8 +++-
arch/arm/mach-s3c
With the spi hardware controller information moved to spi driver data,
this information can be removed from the spi platform data.
Cc: Jaswinder Singh
Signed-off-by: Thomas Abraham
---
arch/arm/mach-exynos/setup-spi.c | 25 --
arch/arm/mach-s3c24xx/setup-sp
Platform data is used to specify controller hardware specific information
such as the tx/rx fifo level mask and bit offset of rx fifo level. Such
information is not suitable to be supplied from device tree. Instead,
it can be moved into the driver data and removed from platform data.
Cc: Jaswinder
The macro S3C64XX_SPI_ST_TRLCNTZ is not used and hence it is removed.
Cc: Jaswinder Singh
Signed-off-by: Thomas Abraham
---
drivers/spi/spi-s3c64xx.c |4
1 files changed, 0 insertions(+), 4 deletions(-)
diff --git a/drivers/spi/spi-s3c64xx.c b/drivers/spi/spi-s3c64xx.c
index 972a94c..
This patch series adds device tree based discovery support for Samsung's
s3c64xx compatible spi controller. This is mainly tested for Exynos4210
and Exynos5250 with onboard spi nor flash device.
This patch series is based on Linux 3.4-rc5 with the following two
patch series applied.
[1] http://ww
On Tue, 8 May 2012 21:48:18 +0530
Amit Daniel Kachhap wrote:
> This patch adds necessary default platform data support needed for TMU driver.
> This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
> platforms.
>
>
> ...
>
> --- a/drivers/thermal/exynos_thermal.c
> +++ b/d
On Tue, 8 May 2012 21:48:17 +0530
Amit Daniel Kachhap wrote:
> This code added creates a link between temperature sensors, linux thermal
> framework and cooling devices for samsung exynos platform. This layer
> monitors the temperature from the sensor and informs the generic thermal
> layer to t
On Tue, 8 May 2012 21:48:15 +0530
Amit Daniel Kachhap wrote:
> This movement is needed because the hwmon entries and corresponding
> sysfs interface is a duplicate of utilities already provided by
> driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
> and add necessary funct
On Tue, 8 May 2012 21:48:14 +0530
Amit Daniel Kachhap wrote:
> This patch adds support for generic cpu thermal cooling low level
> implementations using frequency scaling up/down based on the registration
> parameters. Different cpu related cooling devices can be registered by the
> user and the
On Tue, 8 May 2012 21:48:12 +0530
Amit Daniel Kachhap wrote:
> This patchset introduces a new generic cooling device based on cpufreq that
> can be used on non-ACPI platforms. As a proof of concept, we have drivers for
> the following platforms using this mechanism now:
>
> * TI OMAP (git://gi
Hi, Amit,
Sorry for the late response as I'm in a travel recently.
I think the generic cpufreq cooling patches are good.
But about the THERMAL_TRIP_STATE_INSTANCE patch, what I'd like to see is that
1. from thermal zone point of view, when the temperature is higher than a trip
point, either AC
From: Tushar Behera
CC: Ben Dooks
CC: Kukjin Kim
Signed-off-by: Tushar Behera
Signed-off-by: Heiko Stuebner
---
changes since v1: update the patch to apply against the moved dev-uart devices
As this patch does not touch anything else apart from the uart devices it could
also be applied on top
Signed-off-by: Heiko Stuebner
---
arch/arm/mach-s3c24xx/common.c | 18
arch/arm/plat-s3c24xx/Makefile |1 -
arch/arm/plat-s3c24xx/clock.c | 59
3 files changed, 18 insertions(+), 60 deletions(-)
delete mode 100644 arch/arm/plat-s3c24
This is the basic power-management code used by all s3c24xx machines.
Signed-off-by: Heiko Stuebner
---
arch/arm/mach-s3c24xx/Makefile |4
arch/arm/{plat-s3c24xx => mach-s3c24xx}/irq-pm.c |0
arch/arm/{plat-s3c24xx => mach-s3c24xx}/pm.c |0
arch/arm/{plat-s
The uart devices are used on all s3c24xx machines, so they can reside
in the common code for all machines.
Signed-off-by: Heiko Stuebner
---
arch/arm/mach-s3c24xx/common.c | 73 +++
arch/arm/plat-s3c24xx/Makefile |1 -
arch/arm/plat-s3c24xx/dev-uart.c | 100 ---
Following the model of s3c64xx cpu.c becomes common.c in mach-s3c24xx,
to got more common code added later on.
Signed-off-by: Heiko Stuebner
---
arch/arm/mach-s3c24xx/Makefile |2 ++
.../{plat-s3c24xx/cpu.c => mach-s3c24xx/common.c} |2 +-
arch/arm/plat-s3c24xx/Makef
Again the series of small moves of common code from the plat-s3c24xx to the
mach-s3c24xx directory.
This time without the wrong handled irq.c . Hopefully I'll get time to do it
properly later.
As the dev-uart.c move breaks the resource patch by Tushar Behera, I updated
the patch to fix the correc
This patch inserts exynos5 TMU sensor changes in the thermal driver.
Some exynos4 changes are made generic for exynos series.
Signed-off-by: SangWook Ju
Signed-off-by: Amit Daniel Kachhap
---
drivers/thermal/Kconfig |6 +-
drivers/thermal/exynos_thermal.c |
This movement is needed because the hwmon entries and corresponding
sysfs interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Danie
This patch adds support for generic cpu thermal cooling low level
implementations using frequency scaling up/down based on the registration
parameters. Different cpu related cooling devices can be registered by the
user and the binding of these cooling devices to the corresponding
trip points can b
This patch adds necessary default platform data support needed for TMU driver.
This dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms.
Signed-off-by: Amit Daniel Kachhap
---
drivers/thermal/exynos_thermal.c | 107 +-
1 files cha
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
Signed-off-by: Amit Daniel Kachhap
-
This patch adds a new trip type THERMAL_TRIP_STATE_INSTANCE. This
trip behaves same as THERMAL_TRIP_ACTIVE but also passes the cooling
device instance number. This helps the cooling device registered as
different instances to perform appropriate cooling action decision in
the set_cur_state call bac
Hi Andrew,
This patchset introduces a new generic cooling device based on cpufreq that
can be used on non-ACPI platforms. As a proof of concept, we have drivers for
the following platforms using this mechanism now:
* TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal)
*
On 05/08/2012 09:35 AM, Sylwester Nawrocki wrote:
> On 05/08/2012 07:42 AM, Kukjin Kim wrote:
>> Sylwester Nawrocki wrote:
>>>
>>> Add the gate clocks and register region address definition for
>>> FIMC-LITE devices available in Exynos4x12 and Exynos5 SoCs.
>>>
>> This is right description? I can't
On 05/08/2012 07:42 AM, Kukjin Kim wrote:
> Sylwester Nawrocki wrote:
>>
>> Add the gate clocks and register region address definition for
>> FIMC-LITE devices available in Exynos4x12 and Exynos5 SoCs.
>>
> This is right description? I can't find your changes for EXYNOS4412 and
> EXYNOS5 here. Only
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