Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-11 Thread amit kachhap
On Mon, Sep 10, 2012 at 3:25 PM, Zhang Rui rui.zh...@intel.com wrote:
 Refreshed to remove the notifier mechanism as we do not have a real user of 
 it.
 if there is no problem, I'll apply the whole patch set to thermal next tree.

The removal of notification API looks fine. Thanks for refreshing this.

Thanks,
Amit Daniel

 From: Amit Daniel Kachhap amit.kach...@linaro.org
 Date: Thu, 16 Aug 2012 17:11:40 +0530

 This patchset introduces a new generic cooling device based on cpufreq
 that can be used on non-ACPI platforms.  As a proof of concept, we have
 drivers for the following platforms using this mechanism now:

  * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
  * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
 imx6q_thermal)

 There is a small change in cpufreq cooling registration APIs, so a minor
 change is needed for Freescale platforms.

 Brief Description:

 1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code.  This code is architecture independent.

 2) This patchset adds generic cpu cooling low level implementation
through frequency clipping.  In future, other cpu related cooling
devices may be added here.  An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices.  The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points.  The important APIs exposed are,

a) struct thermal_cooling_device *cpufreq_cooling_register(
 struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

 3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type.  The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.

 A simple data/control flow diagrams is shown below,

 Core Linux thermal -  Exynos thermal interface - Temperature Sensor
   | |
  \|/|
   Cpufreq cooling device ---

 TODO:
 *Will send the DT enablement patches later after the driver is merged.

 This patch:

 Add support for generic cpu thermal cooling low level implementations
 using frequency scaling up/down based on the registration parameters.
 Different cpu related cooling devices can be registered by the user and
 the binding of these cooling devices to the corresponding trip points can
 be easily done as the registration APIs return the cooling device pointer.
 The user of these APIs are responsible for passing clipping frequency .
 The drivers can also register to recieve notification about any cooling
 action called.

 Cc: Guenter Roeck guenter.ro...@ericsson.com
 Cc: SangWook Ju sw...@samsung.com
 Cc: Durgadoss durgados...@intel.com
 Cc: Len Brown l...@kernel.org
 Cc: Jean Delvare kh...@linux-fr.org
 Cc: Kyungmin Park kmp...@infradead.org
 Cc: Kukjin Kim kgene@samsung.com
 Signed-off-by: Zhang Rui rui.zh...@intel.com
 Signed-off-by: Andrew Morton a...@linux-foundation.org
 Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com
 ---
  Documentation/thermal/cpu-cooling-api.txt |   33 ++
  drivers/thermal/Kconfig   |   11 +
  drivers/thermal/Makefile  |1 +
  drivers/thermal/cpu_cooling.c |  450 
 +
  include/linux/cpu_cooling.h   |   58 
  5 files changed, 553 insertions(+), 0 deletions(-)
  create mode 100644 Documentation/thermal/cpu-cooling-api.txt
  create mode 100644 drivers/thermal/cpu_cooling.c
  create mode 100644 include/linux/cpu_cooling.h

 diff --git a/Documentation/thermal/cpu-cooling-api.txt 
 b/Documentation/thermal/cpu-cooling-api.txt
 new file mode 100644
 index 000..6fe9cdb
 --- /dev/null
 +++ b/Documentation/thermal/cpu-cooling-api.txt
 @@ -0,0 +1,33 @@
 +CPU cooling APIs How To
 +===
 +
 +Written by Amit Daniel Kachhap amit.kach...@linaro.org
 +
 +Updated: 12 May 2012
 +
 +Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
 +
 +0. Introduction
 +
 +The generic cpu cooling(freq clipping) provides registration/unregistration 
 APIs
 +to the caller. The binding of the cooling devices to the trip point is left 
 for
 +the user. The registration APIs returns the cooling device pointer.
 +
 +1. cpu cooling APIs
 +
 +1.1 cpufreq registration/unregistration APIs
 +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
 +   struct cpumask *clip_cpus)
 +
 +This interface function registers the cpufreq cooling device with the 
 name
 +thermal-cpufreq-%x. This api can support multiple 

[PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-10 Thread Zhang Rui
Refreshed to remove the notifier mechanism as we do not have a real user of it.
if there is no problem, I'll apply the whole patch set to thermal next tree.

From: Amit Daniel Kachhap amit.kach...@linaro.org
Date: Thu, 16 Aug 2012 17:11:40 +0530

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal -  Exynos thermal interface - Temperature Sensor
  | |
 \|/|
  Cpufreq cooling device ---

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

Cc: Guenter Roeck guenter.ro...@ericsson.com
Cc: SangWook Ju sw...@samsung.com
Cc: Durgadoss durgados...@intel.com
Cc: Len Brown l...@kernel.org
Cc: Jean Delvare kh...@linux-fr.org
Cc: Kyungmin Park kmp...@infradead.org
Cc: Kukjin Kim kgene@samsung.com
Signed-off-by: Zhang Rui rui.zh...@intel.com
Signed-off-by: Andrew Morton a...@linux-foundation.org
Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com
---
 Documentation/thermal/cpu-cooling-api.txt |   33 ++
 drivers/thermal/Kconfig   |   11 +
 drivers/thermal/Makefile  |1 +
 drivers/thermal/cpu_cooling.c |  450 +
 include/linux/cpu_cooling.h   |   58 
 5 files changed, 553 insertions(+), 0 deletions(-)
 create mode 100644 Documentation/thermal/cpu-cooling-api.txt
 create mode 100644 drivers/thermal/cpu_cooling.c
 create mode 100644 include/linux/cpu_cooling.h

diff --git a/Documentation/thermal/cpu-cooling-api.txt 
b/Documentation/thermal/cpu-cooling-api.txt
new file mode 100644
index 000..6fe9cdb
--- /dev/null
+++ b/Documentation/thermal/cpu-cooling-api.txt
@@ -0,0 +1,33 @@
+CPU cooling APIs How To
+===
+
+Written by Amit Daniel Kachhap amit.kach...@linaro.org
+
+Updated: 12 May 2012
+
+Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+
+The generic cpu cooling(freq clipping) provides registration/unregistration 
APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+
+1.1 cpufreq registration/unregistration APIs
+1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
+   struct cpumask *clip_cpus)
+
+This interface function registers the cpufreq cooling device with the name
+thermal-cpufreq-%x. This api can support multiple instances of cpufreq
+cooling devices.
+
+   clip_cpus: cpumask of cpus where the frequency constraints will happen.
+
+1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+This interface function unregisters the thermal-cpufreq-%x 

Re: [PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-10 Thread Valentin, Eduardo
Hello Rui and Amit,

On Mon, Sep 10, 2012 at 9:25 AM, Zhang Rui rui.zh...@intel.com wrote:
 Refreshed to remove the notifier mechanism as we do not have a real user of 
 it.
 if there is no problem, I'll apply the whole patch set to thermal next tree.

 From: Amit Daniel Kachhap amit.kach...@linaro.org
 Date: Thu, 16 Aug 2012 17:11:40 +0530

 This patchset introduces a new generic cooling device based on cpufreq
 that can be used on non-ACPI platforms.  As a proof of concept, we have
 drivers for the following platforms using this mechanism now:

  * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
  * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
 imx6q_thermal)

 There is a small change in cpufreq cooling registration APIs, so a minor
 change is needed for Freescale platforms.

 Brief Description:

 1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code.  This code is architecture independent.

 2) This patchset adds generic cpu cooling low level implementation
through frequency clipping.  In future, other cpu related cooling
devices may be added here.  An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices.  The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points.  The important APIs exposed are,

a) struct thermal_cooling_device *cpufreq_cooling_register(
 struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

 3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type.  The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.

 A simple data/control flow diagrams is shown below,

 Core Linux thermal -  Exynos thermal interface - Temperature Sensor
   | |
  \|/|
   Cpufreq cooling device ---

 TODO:
 *Will send the DT enablement patches later after the driver is merged.

 This patch:

 Add support for generic cpu thermal cooling low level implementations
 using frequency scaling up/down based on the registration parameters.
 Different cpu related cooling devices can be registered by the user and
 the binding of these cooling devices to the corresponding trip points can
 be easily done as the registration APIs return the cooling device pointer.
 The user of these APIs are responsible for passing clipping frequency .
 The drivers can also register to recieve notification about any cooling
 action called.

 Cc: Guenter Roeck guenter.ro...@ericsson.com
 Cc: SangWook Ju sw...@samsung.com
 Cc: Durgadoss durgados...@intel.com
 Cc: Len Brown l...@kernel.org
 Cc: Jean Delvare kh...@linux-fr.org
 Cc: Kyungmin Park kmp...@infradead.org
 Cc: Kukjin Kim kgene@samsung.com
 Signed-off-by: Zhang Rui rui.zh...@intel.com
 Signed-off-by: Andrew Morton a...@linux-foundation.org
 Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com


can you please include my Reviewed-by? Also on your patch series I
have reviewed.

Reviewed-by: Eduardo Valentin eduardo.valen...@ti.com



 ---
  Documentation/thermal/cpu-cooling-api.txt |   33 ++
  drivers/thermal/Kconfig   |   11 +
  drivers/thermal/Makefile  |1 +
  drivers/thermal/cpu_cooling.c |  450 
 +
  include/linux/cpu_cooling.h   |   58 
  5 files changed, 553 insertions(+), 0 deletions(-)
  create mode 100644 Documentation/thermal/cpu-cooling-api.txt
  create mode 100644 drivers/thermal/cpu_cooling.c
  create mode 100644 include/linux/cpu_cooling.h

 diff --git a/Documentation/thermal/cpu-cooling-api.txt 
 b/Documentation/thermal/cpu-cooling-api.txt
 new file mode 100644
 index 000..6fe9cdb
 --- /dev/null
 +++ b/Documentation/thermal/cpu-cooling-api.txt
 @@ -0,0 +1,33 @@
 +CPU cooling APIs How To
 +===
 +
 +Written by Amit Daniel Kachhap amit.kach...@linaro.org
 +
 +Updated: 12 May 2012
 +
 +Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
 +
 +0. Introduction
 +
 +The generic cpu cooling(freq clipping) provides registration/unregistration 
 APIs
 +to the caller. The binding of the cooling devices to the trip point is left 
 for
 +the user. The registration APIs returns the cooling device pointer.
 +
 +1. cpu cooling APIs
 +
 +1.1 cpufreq registration/unregistration APIs
 +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
 +   struct cpumask *clip_cpus)
 +
 +This interface function registers the cpufreq cooling device 

Re: [PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-10 Thread Zhang Rui
On δΈ€, 2012-09-10 at 09:50 +0300, Valentin, Eduardo wrote:
 Hello Rui and Amit,
 
 On Mon, Sep 10, 2012 at 9:25 AM, Zhang Rui rui.zh...@intel.com wrote:
  Refreshed to remove the notifier mechanism as we do not have a real user of 
  it.
  if there is no problem, I'll apply the whole patch set to thermal next tree.
 
  From: Amit Daniel Kachhap amit.kach...@linaro.org
  Date: Thu, 16 Aug 2012 17:11:40 +0530
 
  This patchset introduces a new generic cooling device based on cpufreq
  that can be used on non-ACPI platforms.  As a proof of concept, we have
  drivers for the following platforms using this mechanism now:
 
   * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
   * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
  imx6q_thermal)
 
  There is a small change in cpufreq cooling registration APIs, so a minor
  change is needed for Freescale platforms.
 
  Brief Description:
 
  1) The generic cooling devices code is placed inside driver/thermal/*
 as placing inside acpi folder will need un-necessary enabling of acpi
 code.  This code is architecture independent.
 
  2) This patchset adds generic cpu cooling low level implementation
 through frequency clipping.  In future, other cpu related cooling
 devices may be added here.  An ACPI version of this already exists
 (drivers/acpi/processor_thermal.c) .But this will be useful for
 platforms like ARM using the generic thermal interface along with the
 generic cpu cooling devices.  The cooling device registration API's
 return cooling device pointers which can be easily binded with the
 thermal zone trip points.  The important APIs exposed are,
 
 a) struct thermal_cooling_device *cpufreq_cooling_register(
  struct cpumask *clip_cpus)
 b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 
  3) Samsung exynos platform thermal implementation is done using the
 generic cpu cooling APIs and the new trip type.  The temperature sensor
 driver present in the hwmon folder(registered as hwmon driver) is moved
 to thermal folder and registered as a thermal driver.
 
  A simple data/control flow diagrams is shown below,
 
  Core Linux thermal -  Exynos thermal interface - Temperature 
  Sensor
| |
   \|/|
Cpufreq cooling device ---
 
  TODO:
  *Will send the DT enablement patches later after the driver is merged.
 
  This patch:
 
  Add support for generic cpu thermal cooling low level implementations
  using frequency scaling up/down based on the registration parameters.
  Different cpu related cooling devices can be registered by the user and
  the binding of these cooling devices to the corresponding trip points can
  be easily done as the registration APIs return the cooling device pointer.
  The user of these APIs are responsible for passing clipping frequency .
  The drivers can also register to recieve notification about any cooling
  action called.
 
  Cc: Guenter Roeck guenter.ro...@ericsson.com
  Cc: SangWook Ju sw...@samsung.com
  Cc: Durgadoss durgados...@intel.com
  Cc: Len Brown l...@kernel.org
  Cc: Jean Delvare kh...@linux-fr.org
  Cc: Kyungmin Park kmp...@infradead.org
  Cc: Kukjin Kim kgene@samsung.com
  Signed-off-by: Zhang Rui rui.zh...@intel.com
  Signed-off-by: Andrew Morton a...@linux-foundation.org
  Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com
 
 
 can you please include my Reviewed-by? Also on your patch series I
 have reviewed.
 
sure.

 Reviewed-by: Eduardo Valentin eduardo.valen...@ti.com
 
thanks!

-rui
 
 
  ---
   Documentation/thermal/cpu-cooling-api.txt |   33 ++
   drivers/thermal/Kconfig   |   11 +
   drivers/thermal/Makefile  |1 +
   drivers/thermal/cpu_cooling.c |  450 
  +
   include/linux/cpu_cooling.h   |   58 
   5 files changed, 553 insertions(+), 0 deletions(-)
   create mode 100644 Documentation/thermal/cpu-cooling-api.txt
   create mode 100644 drivers/thermal/cpu_cooling.c
   create mode 100644 include/linux/cpu_cooling.h
 
  diff --git a/Documentation/thermal/cpu-cooling-api.txt 
  b/Documentation/thermal/cpu-cooling-api.txt
  new file mode 100644
  index 000..6fe9cdb
  --- /dev/null
  +++ b/Documentation/thermal/cpu-cooling-api.txt
  @@ -0,0 +1,33 @@
  +CPU cooling APIs How To
  +===
  +
  +Written by Amit Daniel Kachhap amit.kach...@linaro.org
  +
  +Updated: 12 May 2012
  +
  +Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
  +
  +0. Introduction
  +
  +The generic cpu cooling(freq clipping) provides 
  registration/unregistration APIs
  +to the caller. The binding of the cooling devices to the trip point is 
  left for
  +the user. The registration APIs returns the cooling device pointer.
  +
  +1. cpu cooling APIs
  +
  +1.1 cpufreq 

Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-10 Thread Rafael J. Wysocki
On Monday, September 10, 2012, Rafael J. Wysocki wrote:
 On Monday, September 10, 2012, Zhang Rui wrote:
  Refreshed to remove the notifier mechanism as we do not have a real user of 
  it.
  if there is no problem, I'll apply the whole patch set to thermal next tree.
  
  From: Amit Daniel Kachhap amit.kach...@linaro.org
  Date: Thu, 16 Aug 2012 17:11:40 +0530
  
  This patchset introduces a new generic cooling device based on cpufreq
  that can be used on non-ACPI platforms.  As a proof of concept, we have
  drivers for the following platforms using this mechanism now:
  
   * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
   * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
  imx6q_thermal)
  
  There is a small change in cpufreq cooling registration APIs, so a minor
  change is needed for Freescale platforms.
  
  Brief Description:
  
  1) The generic cooling devices code is placed inside driver/thermal/*
 as placing inside acpi folder will need un-necessary enabling of acpi
 code.  This code is architecture independent.
  
  2) This patchset adds generic cpu cooling low level implementation
 through frequency clipping.  In future, other cpu related cooling
 devices may be added here.  An ACPI version of this already exists
 (drivers/acpi/processor_thermal.c) .But this will be useful for
 platforms like ARM using the generic thermal interface along with the
 generic cpu cooling devices.  The cooling device registration API's
 return cooling device pointers which can be easily binded with the
 thermal zone trip points.  The important APIs exposed are,
  
 a) struct thermal_cooling_device *cpufreq_cooling_register(
  struct cpumask *clip_cpus)
 b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
  
  3) Samsung exynos platform thermal implementation is done using the
 generic cpu cooling APIs and the new trip type.  The temperature sensor
 driver present in the hwmon folder(registered as hwmon driver) is moved
 to thermal folder and registered as a thermal driver.
  
  A simple data/control flow diagrams is shown below,
  
  Core Linux thermal -  Exynos thermal interface - Temperature 
  Sensor
| |
   \|/|
Cpufreq cooling device ---
  
  TODO:
  *Will send the DT enablement patches later after the driver is merged.
  
  This patch:
  
  Add support for generic cpu thermal cooling low level implementations
  using frequency scaling up/down based on the registration parameters.
  Different cpu related cooling devices can be registered by the user and
  the binding of these cooling devices to the corresponding trip points can
  be easily done as the registration APIs return the cooling device pointer.
  The user of these APIs are responsible for passing clipping frequency .
  The drivers can also register to recieve notification about any cooling
  action called.
  
  Cc: Guenter Roeck guenter.ro...@ericsson.com
  Cc: SangWook Ju sw...@samsung.com
  Cc: Durgadoss durgados...@intel.com
  Cc: Len Brown l...@kernel.org
  Cc: Jean Delvare kh...@linux-fr.org
  Cc: Kyungmin Park kmp...@infradead.org
  Cc: Kukjin Kim kgene@samsung.com
  Signed-off-by: Zhang Rui rui.zh...@intel.com
  Signed-off-by: Andrew Morton a...@linux-foundation.org
  Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com
 
 Can you please resend the patch inline (i.e. not as an attachment)?

Sorry, it was inline (obviously).  I seem to be too tired.

Please resend it to linux...@vger.kernel.org.  The linux-pm list at
linux-foundation.org is not functional any more.

Thanks,
Rafael
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Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation

2012-09-10 Thread Rafael J. Wysocki
On Monday, September 10, 2012, Zhang Rui wrote:
 Refreshed to remove the notifier mechanism as we do not have a real user of 
 it.
 if there is no problem, I'll apply the whole patch set to thermal next tree.
 
 From: Amit Daniel Kachhap amit.kach...@linaro.org
 Date: Thu, 16 Aug 2012 17:11:40 +0530
 
 This patchset introduces a new generic cooling device based on cpufreq
 that can be used on non-ACPI platforms.  As a proof of concept, we have
 drivers for the following platforms using this mechanism now:
 
  * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
  * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git 
 imx6q_thermal)
 
 There is a small change in cpufreq cooling registration APIs, so a minor
 change is needed for Freescale platforms.
 
 Brief Description:
 
 1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code.  This code is architecture independent.
 
 2) This patchset adds generic cpu cooling low level implementation
through frequency clipping.  In future, other cpu related cooling
devices may be added here.  An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices.  The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points.  The important APIs exposed are,
 
a) struct thermal_cooling_device *cpufreq_cooling_register(
 struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 
 3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type.  The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
 
 A simple data/control flow diagrams is shown below,
 
 Core Linux thermal -  Exynos thermal interface - Temperature Sensor
   | |
  \|/|
   Cpufreq cooling device ---
 
 TODO:
 *Will send the DT enablement patches later after the driver is merged.
 
 This patch:
 
 Add support for generic cpu thermal cooling low level implementations
 using frequency scaling up/down based on the registration parameters.
 Different cpu related cooling devices can be registered by the user and
 the binding of these cooling devices to the corresponding trip points can
 be easily done as the registration APIs return the cooling device pointer.
 The user of these APIs are responsible for passing clipping frequency .
 The drivers can also register to recieve notification about any cooling
 action called.
 
 Cc: Guenter Roeck guenter.ro...@ericsson.com
 Cc: SangWook Ju sw...@samsung.com
 Cc: Durgadoss durgados...@intel.com
 Cc: Len Brown l...@kernel.org
 Cc: Jean Delvare kh...@linux-fr.org
 Cc: Kyungmin Park kmp...@infradead.org
 Cc: Kukjin Kim kgene@samsung.com
 Signed-off-by: Zhang Rui rui.zh...@intel.com
 Signed-off-by: Andrew Morton a...@linux-foundation.org
 Signed-off-by: Amit Daniel Kachhap amit.dan...@samsung.com

Can you please resend the patch inline (i.e. not as an attachment)?

Rafael
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