Re: [linux-pm] [RESEND PATCH v4 1/5] thermal: add generic cpufreq cooling implementation
On Thu, Jul 12, 2012 at 8:40 PM, Valentin, Eduardo eduardo.valen...@ti.com wrote: Amit, On Thu, Jul 12, 2012 at 4:41 PM, Amit Daniel Kachhap amit.kach...@linaro.org wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal) FYI, I have rewriten the OMAP BG driver and currently trying to push it to staging area. It should now support more omap versions. I will readapt the cpu cooling based on this patch. I am keeping the reworked driver here: g...@gitorious.org:thermal-framework/thermal-framework.git thermal_work/omap/bandgap_staging Yes Eduardo, The link I have given here is slightly old. After your implementation is done maybe this link can be updated. Thanks, Amit D * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for OMAP and Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This codes is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) . But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct freq_clip_table *tab_ptr, unsigned int tab_size) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Donggeun Kim dg77@samsung.com Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Signed-off-by: Andrew Morton a...@linux-foundation.org --- Documentation/thermal/cpu-cooling-api.txt | 60 drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |3 +- drivers/thermal/cpu_cooling.c | 483 + include/linux/cpu_cooling.h | 99 ++ 5 files changed, 655 insertions(+), 1 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..557adb8 --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,60 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping, cpuhotplug etc) provides +registration/unregistration APIs to the caller. The binding of the cooling +devices to the trip point is left for the user. The registration APIs returns +the cooling
Re: [linux-pm] [RESEND PATCH v4 1/5] thermal: add generic cpufreq cooling implementation
On Fri, Jul 13, 2012 at 4:34 AM, Andrew Morton a...@linux-foundation.org wrote: On Thu, 12 Jul 2012 19:11:04 +0530 Amit Daniel Kachhap amit.kach...@linaro.org wrote: [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Donggeun Kim dg77@samsung.com Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Signed-off-by: Andrew Morton a...@linux-foundation.org Something strange appears to have happened here? At a guess it seems that the patches were in my tree, I sent them to someone (Len?), then they were merged into linux-next by someone and then they fell out of linux-next again? If so, they will hopefully come back soon. If not, something failed fairly seriously. Hi Andrew, Yes you are right that this patches first came into your tree and then Len applied into his next tree for 3.5 merge. so they got into linux-next tree. After some last minute pull issues they could not be merged in 3.5 and Len dropped this series from his -next branch. I hope to get it accepted in 3.6 merge. I am aware that some work is going on for thermal framework improvement but that will have minimal changes on cpufreq cooling APIs and I hope to fix them as bug fix patches. I took a look at re-merging these patches into my tree, but there are significant conflicts with other work which has gone into linux-next. Its my fault that I didn't check the hwmon-next branch. I will repost them after merging with hwmon-next branch. Thanks, Amit Daniel -- To unsubscribe from this list: send the line unsubscribe linux-samsung-soc in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
Re: [linux-pm] [RESEND PATCH v4 1/5] thermal: add generic cpufreq cooling implementation
Hello everyone, I am new to linux and i also want to contribute in linux community. I am running Ubuntu 11.04 and i have downloaded linux-2.6.35.13 for learning. so kindly tell me how to set up and starting kernel development. I did tried some books and websites but i am still unable to do some productive work. So,, its my request that kindly help me in setting up the environment and start learning. Regards Rakesh kumar -- To unsubscribe from this list: send the line unsubscribe linux-samsung-soc in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
Re: [linux-pm] [RESEND PATCH v4 1/5] thermal: add generic cpufreq cooling implementation
Amit, On Thu, Jul 12, 2012 at 4:41 PM, Amit Daniel Kachhap amit.kach...@linaro.org wrote: This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal) FYI, I have rewriten the OMAP BG driver and currently trying to push it to staging area. It should now support more omap versions. I will readapt the cpu cooling based on this patch. I am keeping the reworked driver here: g...@gitorious.org:thermal-framework/thermal-framework.git thermal_work/omap/bandgap_staging * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for OMAP and Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This codes is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) . But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct freq_clip_table *tab_ptr, unsigned int tab_size) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal - Exynos thermal interface - Temperature Sensor | | \|/| Cpufreq cooling device --- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [a...@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap amit.kach...@linaro.org Cc: Donggeun Kim dg77@samsung.com Cc: Guenter Roeck guenter.ro...@ericsson.com Cc: SangWook Ju sw...@samsung.com Cc: Durgadoss durgados...@intel.com Cc: Len Brown l...@kernel.org Cc: Jean Delvare kh...@linux-fr.org Signed-off-by: Andrew Morton a...@linux-foundation.org --- Documentation/thermal/cpu-cooling-api.txt | 60 drivers/thermal/Kconfig | 11 + drivers/thermal/Makefile |3 +- drivers/thermal/cpu_cooling.c | 483 + include/linux/cpu_cooling.h | 99 ++ 5 files changed, 655 insertions(+), 1 deletions(-) create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 include/linux/cpu_cooling.h diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt new file mode 100644 index 000..557adb8 --- /dev/null +++ b/Documentation/thermal/cpu-cooling-api.txt @@ -0,0 +1,60 @@ +CPU cooling APIs How To +=== + +Written by Amit Daniel Kachhap amit.kach...@linaro.org + +Updated: 12 May 2012 + +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) + +0. Introduction + +The generic cpu cooling(freq clipping, cpuhotplug etc) provides +registration/unregistration APIs to the caller. The binding of the cooling +devices to the trip point is left for the user. The registration APIs returns +the cooling device pointer. + +1. cpu cooling APIs + +1.1 cpufreq registration/unregistration APIs +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( + struct freq_clip_table *tab_ptr, unsigned int tab_size) + +This
