I am not beting exact on the actual thickness of the Ni/Au as its not
specified in the board report, only that the outer serfaces are plated to
1oz, part of that plating will be copper when the via and through hole
connections are made.
The manufacturers report only states the plate thickness,
John Said:
Another test: if you run two bare boards through reflow, with one
top facing up and the other facing down, do both boards warp in
the same direction, or is it always toward the top (or bottom,
as the case may be). The former would point to a reflow issue, while
the latter would be
At 01:08 PM 4/5/2002 +0100, [EMAIL PROTECTED] wrote:
Is there any way of excluding a component footprint from a DRC check?
You can set special rules for footprints, components, component classes, or
specific footprint pads, from some DRC checks, particularly Clearance
Constraint and a series
