[PEDA] TSSOP Power Pad

2002-03-05 Thread Steve Baldwin
Does anyone have pointers to footprint guidelines for Power Pad parts, particularly TSSOP (28 pin in this case). If I put a pad down the same size as the powerpad and screen solder onto it, I would expect the part to sit up on the meniscus when the solder melts and I'd get poor/missed joints

Re: [PEDA] TSSOP Power Pad

2002-03-05 Thread Brad Velander
]] Sent: Tuesday, March 05, 2002 1:26 PM To: Protel EDA Forum Subject: [PEDA] TSSOP Power Pad Does anyone have pointers to footprint guidelines for Power Pad parts, particularly TSSOP (28 pin in this case). If I put a pad down the same size as the powerpad and screen solder onto it, I would expect

Re: [PEDA] TSSOP Power Pad

2002-03-05 Thread Brian Guralnick
Can you offer a part# as an example link to a data sheet. Brian Guralnick - Original Message - From: Steve Baldwin [EMAIL PROTECTED] To: Protel EDA Forum [EMAIL PROTECTED] Sent: Tuesday, March 05, 2002 4:25 PM Subject: [PEDA] TSSOP Power Pad | Does anyone have pointers

Re: [PEDA] TSSOP Power Pad

2002-03-05 Thread Clive . Broome
soldering if required. Clive Steve Baldwin [EMAIL PROTECTED] on 03/06/2002 07:25:59 AM Please respond to Protel EDA Forum [EMAIL PROTECTED] To: Protel EDA Forum [EMAIL PROTECTED] cc:(bcc: Clive Broome/sdc) Subject: [PEDA] TSSOP Power Pad Does anyone have pointers to footprint

Re: [PEDA] TSSOP Power Pad

2002-03-05 Thread Steve Baldwin
I checked the source we use for our footprints and on the TSSOP 28 pin devices with the bottom tab, they suggest a pad the same size as the tab and their common solder paste deposition of 0.006 - 0.008 Ah ! The penny drops. That corresponds to the distance between the base of the package

Re: [PEDA] TSSOP Power Pad

2002-03-05 Thread Brad Velander
]] Sent: Tuesday, March 05, 2002 4:53 PM To: Protel EDA Forum Subject: Re: [PEDA] TSSOP Power Pad I checked the source we use for our footprints and on the TSSOP 28 pin devices with the bottom tab, they suggest a pad the same size as the tab and their common solder paste deposition of 0.006