Re: [PEDA] closing pads on paste mask

2002-01-14 Thread Emanuel Zimmermann

That's for sure. The exception where I see (and have) the 
need for avoiding solder paste is where I have designed for 
several assembly variants with intersecting component 
patterns due to constraints in available board area. There 
it is required to avoid solder paste for example underneath 
any IC package.

Emanuel

Brad Velander wrote:

 Good suggestion Dennis,
   a reflow soldered pad will be much easier to solder a component into
 at any later point in time, especially after the board has possibly gone
 through several heat or reflow cycles. This would not be such an issue if
 the board was plated with tin/lead and reflowed during fabrication. For OSP,
 organic silver, organic tin and even some gold flash treatments this could
 be critical to possible future soldering of those pads.
 
 Sincerely,
 Brad Velander.
 
 Lead PCB Designer
 Norsat International Inc.
 #300 - 4401 Still Creek Drive,
 Burnaby, B.C., Canada, V5C 6G9.
 Tel   (604) 292-9089 (direct line)
 Fax  (604) 292-9010
 Website: www.norsat.com
 
 
 -Original Message-
 From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
 Sent: Friday, January 11, 2002 9:22 AM
 To: Protel EDA Forum
 Subject: Re: [PEDA] closing pads on paste mask
 
 
 more than one assembler has advised me to let unpopulated parts be
 solder pasted and reflowed as if there were parts on them
 the reason given was that the pads if not pasted get tarnished and
 crummy looking
 (it's also easier!)
 
 Dennis Saputelli
 
 


-- 


MPL AG  www.mpl.ch
Emanuel Zimmermann  [EMAIL PROTECTED]
Manager RD Phone: +41 (0)56 483 34 34
Taefernstrasse 20   Fax:   +41 (0)56 493 30 20

CH-5405 Daettwil



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Re: [PEDA] closing pads on paste mask

2002-01-11 Thread Dennis Saputelli

more than one assembler has advised me to let unpopulated parts be
solder pasted and reflowed as if there were parts on them
the reason given was that the pads if not pasted get tarnished and
crummy looking
(it's also easier!)

Dennis Saputelli


Emanuel Zimmermann wrote:
 
 Our production people do that sort of things with very thin
 tapes. This has the advantage of avoiding separate paste
 masks for every assembly variant for small production lot
 quantities.
 
 However, if your production lots are quite big you could set
 the paste mask enlargment for the parts in question to
 negative values. This is done in the advanced tab of the
 properties dialog box when double clicking the component in
 the PCB editor.
 
 Emanuel
 
 Georg Beckmann wrote:
 
  some boards are party assembled and some places for components left free.
  For this purpose the production wants a paste mask with closed pads for this
  parts.
 
  Has anybody an idea how this is done clever.
 
  Georg
 
 
 
 --
 
 
 MPL AG  www.mpl.ch
 Emanuel Zimmermann  [EMAIL PROTECTED]
 Manager RD Phone: +41 (0)56 483 34 34
 Taefernstrasse 20   Fax:   +41 (0)56 493 30 20
 
 CH-5405 Daettwil
 

-- 
___
www.integratedcontrolsinc.comIntegrated Controls, Inc.
   tel: 415-647-04802851 21st Street  
  fax: 415-647-3003San Francisco, CA 94110

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Re: [PEDA] closing pads on paste mask

2002-01-11 Thread Brad Velander

Good suggestion Dennis,
a reflow soldered pad will be much easier to solder a component into
at any later point in time, especially after the board has possibly gone
through several heat or reflow cycles. This would not be such an issue if
the board was plated with tin/lead and reflowed during fabrication. For OSP,
organic silver, organic tin and even some gold flash treatments this could
be critical to possible future soldering of those pads.

Sincerely,
Brad Velander.

Lead PCB Designer
Norsat International Inc.
#300 - 4401 Still Creek Drive,
Burnaby, B.C., Canada, V5C 6G9.
Tel   (604) 292-9089 (direct line)
Fax  (604) 292-9010
Website: www.norsat.com


-Original Message-
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Friday, January 11, 2002 9:22 AM
To: Protel EDA Forum
Subject: Re: [PEDA] closing pads on paste mask


more than one assembler has advised me to let unpopulated parts be
solder pasted and reflowed as if there were parts on them
the reason given was that the pads if not pasted get tarnished and
crummy looking
(it's also easier!)

Dennis Saputelli

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Re: [PEDA] closing pads on paste mask

2002-01-10 Thread Geoff Harland

 Some boards are party assembled and some places for components left free.
 For this purpose the production wants a paste mask with closed pads for
this
 parts.

 Has anybody an idea how this is done clever.

 Georg Beckmann

Define a (Paste Mask Expansion) Design Rule, and set an expansion value
which is sufficiently negative to mask all of the pads concerned. I would
suggest defining a Component Class, with a name like NoPasteMask (for
instance), and add all appropriate components to that class. The Design
Rule's selection criteria should then be that (component) class.

Regards,
Geoff Harland.
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Re: [PEDA] closing pads on paste mask

2002-01-10 Thread Emanuel Zimmermann

Our production people do that sort of things with very thin 
tapes. This has the advantage of avoiding separate paste 
masks for every assembly variant for small production lot 
quantities.

However, if your production lots are quite big you could set 
the paste mask enlargment for the parts in question to 
negative values. This is done in the advanced tab of the 
properties dialog box when double clicking the component in 
the PCB editor.

Emanuel

Georg Beckmann wrote:

 some boards are party assembled and some places for components left free.
 For this purpose the production wants a paste mask with closed pads for this
 parts.
 
 Has anybody an idea how this is done clever.
 
 Georg
 
 


-- 


MPL AG  www.mpl.ch
Emanuel Zimmermann  [EMAIL PROTECTED]
Manager RD Phone: +41 (0)56 483 34 34
Taefernstrasse 20   Fax:   +41 (0)56 493 30 20

CH-5405 Daettwil


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