> Hello Airframe Team, attached are a few snapshots of the first > proposed mounting technique for the new PC-104 flight computer > stack...
Sweet! I love it! > Constraints: It doesn't look like there's room for a fourth PCB on that stack. Is that true? If not, could we add that possibility? It might turn out to be very, very convenient to have a FC "breakout" board as a fourth board. Also, how far apart is the heatsink from the C channel? Can we arrange for it to be exactly one thickness of thermal interface material (TIM)? > -There is no support on the top edges of the PCB. We could add foam > or other material to help handle upward loads (i.e. during recovery > and hitting the ground. However, this also means that if the battery > box pushes downward, those forces will be passed thru the PCB's, not > desirable. .. which is why I wouldn't put anything up there. I bet we're OK, unless we lawn dart, but we shouldn't design for that. > There's also the question of how much of a moment can we apply to > those 0.6" standoffs, noting that they are 4-40 threaded. Can we directly answer this question using SolidWorks coolness? Andrew -- ------------------------------------------------------- Andrew Greenberg Portland State Aerospace Society (http://psas.pdx.edu/) and...@psas.pdx.edu C: 503.708.7711 ------------------------------------------------------- _______________________________________________ psas-airframe mailing list psas-airframe@lists.psas.pdx.edu http://lists.psas.pdx.edu/mailman/listinfo/psas-airframe
