Here's a handy document I found when digging around the NXP website:
http://www.nxp.com/acrobat_download/packages/footprint/FOOTPRINT-HTQFP-HLQFP-LQFP-REFLOW.pdf
It gives the layout as recommended by NXP. Note that the thermal pads
in the center of the layout are for the HTQ packages only and
Make them all the same size.
Wave soldering pads are sometimes done with larger corners. In my
opinion reflow pads should be equal throughout.
(2009.04.11) kenz...@yahoo.com:
>
> I'm doing the IC layout for the LPC2368 and I have a small discrepancy
> in land layouts that I would like clarificat
