I understand several of the modern MEMS OCXO's use microcontroller PID
control for the temperature, avoiding the need for any large capacitors for
compensation.
The microcontroller does a lot more than the heating job, judging by the
PhD thesis I see coming out of China. They seem to feed-forward
On 9/15/2019 1:32 PM, Club Internet wrote:
Rick,
Thanks for this information. Actually the technology of C18 is not specified in
the manual.
Why should it necessarily be « foil » type and metallized?
Is « foil » type same as « film » type?
Of course the « mass » needs to be there (=> 3D
Rick,
Thanks for this information. Actually the technology of C18 is not specified in
the manual.
Why should it necessarily be « foil » type and metallized?
Is « foil » type same as « film » type?
Of course the « mass » needs to be there (=> 3D printing services)
Best
Gilles.
> Le 15 sept. 2019
On 9/14/19 7:43 PM, Richard (Rick) Karlquist wrote:
In the 40 years since the 10811 was designed, AFAIK, there
as been zero (0) progress with respect to the capacitance
per cubic centimeter of foil capacitors.
I think that's because you're up against physics - foils can only be so
thin
The 10811 oven loop is only barely stable. It's stability
is limited by the amount of capacitance that you can
get in a cap of the size that will physically fit. BTW, this
cap must be of the foil type, not the metallized type.
If you are building a knock off of the 10811 and you can
fit in more
Yes, I have more or less cloned the temperature regulation circuitryand used it
for various heat control circuitry using other/similarsemiconductors that can
handle elevated temperatures.
The basic principle is nothing exotic. It can be found inmany applications all
over the internet.
What
