On Sun, Oct 17, 2021 at 01:44:31PM +0300, Dzmitry Sankouski wrote:
> Hi-end qualcomm chip, introduced in late 2017.
> Mostly used in flagship phones and tablets of 2018.
> Features:
> - arm64 arch
> - total of 8 Kryo 385 Gold / Silver cores
> - Hexagon 685 DSP
> - Adreno 630 GPU
>
> Tested only
Hi-end qualcomm chip, introduced in late 2017.
Mostly used in flagship phones and tablets of 2018.
Features:
- arm64 arch
- total of 8 Kryo 385 Gold / Silver cores
- Hexagon 685 DSP
- Adreno 630 GPU
Tested only as second-stage bootloader.
Signed-off-by: Dzmitry Sankouski
Cc: Ramon Fried
Cc:
Hi-end qualcomm chip, introduced in late 2017.
Mostly used in flagship phones and tablets of 2018.
Features:
- arm64 arch
- total of 8 Kryo 385 Gold / Silver cores
- Hexagon 685 DSP
- Adreno 630 GPU
Tested only as second-stage bootloader.
Signed-off-by: Dzmitry Sankouski
Cc: Ramon Fried
Cc:
From: Dzmitry Sankouski
Hi-end qualcomm chip, introduced in late 2017.
Mostly used in flagship phones and tablets of 2018.
Features:
- arm64 arch
- total of 8 Kryo 385 Gold / Silver cores
- Hexagon 685 DSP
- Adreno 630 GPU
Tested only as second-stage bootloader.
Signed-off-by: Dzmitry
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