I will argue that this issue is extremely relevant, especially in low voltage
and low resistance measurements. You are correct in your position if the entire
junction is in thermal stability. If however, the junction is exposed to a
sudden change in temperature, air drafts being the most
All this talk about thermal EMFs may not be particularly relevant.
Solder is used in connections between two metallic objects, like wire and
a terminal. The thermal EMFs between a soldered copper wire and copper terminal
have exactly equal and opposite values between the solder and the metals.
I
On Wed, Jul 06, 2016 at 08:53:19PM +0200, Andrea Baldoni wrote:
> On Wed, Jul 06, 2016 at 03:42:18PM +0200, Herbert Poetzl wrote:
>> Any plans on testing Sn42/Bi57.6/Ag0.4 ?
> Hello Herbert.
Hey Andrea,
> I don't have any source of it. My supplier (Heraeus) hasn't it,
> at least, it wasn't
