convection toaster oven. I haven't done a functional check yet of the board, but did check for shorts and opens
and found none. The LFCSP was a lot easier to solder than a 56 pin ssop(it has fragile leads that are easily
bent). Also, under a 10 or 20 power microscope, I think it is possible with a very small tip to individually solder
each lead since they wrap around the sides.
Dave - WB6DHW
> Hi Michael
>
> I'm under no illusions about the ease of use. I haven't seen anyone amateurs
> use these yet. I might try to find some test samples of the 56 "pin" LFCSP
> to practice soldering with. I think I've seen something like that in the
> past.
>
> If I find pin by pin soldering to be to difficult I'll tack it down and try
> the swipe approach. Failing that it will be to full reflow for the pins and
> perhaps the AGND pad underneath.
>
> These kind of packages are attractive for AD and OEMs since they don't have
> fragile leads, provide for denser boards and have better RF characteristics.
> For those reasons I believe we'll see their use widen, especially as higher
> performance parts are introduced.
>
> I figure if I don't keep up with the packaging technology used by those who
> "pay the bills" I'll get left behind.
>
> 73
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