Hello Mike and All,
> I removed the LDVS (was not fun) and CAREFULLY soldered in the CMOS
> I removed the CMOS (not fun again) and soldered in the LDVS version
It happens that I have soldered mine this week. But before soldering,
I have devised a tip to unsolder it, just in case!
So here is the story:
The goal is to solder the Si570 at a small height (0.5mm) above the board.
1 - Put a small drop of solder on each of the 8 pads.
2 - Make a U shape with a piece of .05 mm wire. I took 2 inches of
wire wrapping wire (30 AWG/0.5 insulation diameter).
3 - Put the U on the board and solder the Si570.
4 - Remove the wire.
------X------
| |
X X
____| |_______________X <- soldered on a
/ | | pad or PCB track
( X Si570 X wire to avoid too
\____| |_______________X <- much move
| |
X X
| |
------X------
"If" I have to remove the chip, I will place a piece of magnet wire
(30 AWG for ex) under it and unsolder one pad at a time by moving the
wire while the solder is melted. A well known solution.
(Once more it will be a good idea to fix one end of the magnet wire
by soldering it on the board.)
I hope that this explanation is "enough" clear, sorry for my
school level English!
Good luck with the Si570, a real marvel
73 Francis
