Rick Karlquist wrote: > We didn't use the epoxy for encapsulation. We used to in place > of soldering to see if we could replace solder with epoxy. Nope. > > Is polyimide or PTFE board less hygroscopic than FR-4? Anyway, > we didn't try that (too much trouble).
PTFE is very hydrophobic. Also has good RF properties. I think it would handle humidity better than FR4. Reinforced PTFE is another matter. Tossing glas-fibers into PTFE would allow humidity both around the glas fiber as well as asorbed by the glas itself. Glas (silica) fibers absorbs a slight amount of humidity and the hydroxyl absorbtion separates the 1310 nm and 1550 nm bands we use at the higher speeds and lengths. Cheers, Magnus _______________________________________________ time-nuts mailing list -- [email protected] To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.
