Dear all,

Please see below the Call for Papers for International Conference on
Embedded Wireless Systems and Networks (EWSN) 2017. The new deadline
for paper registration is September 19th, 2016 (tomorrow) and full
paper submission is September 26th, 2016. We look forward to your
paper submissions.

- om_p

---

-*= International Conference on Embedded Wireless Systems and Networks
(EWSN) =*-
    In cooperation with ACM SIGBED
    Uppsala, Sweden, February 20-22, 2017
    http://www.ewsn2017.org

*Call for Papers*

The International Conference on Embedded Wireless Systems and Networks
(EWSN) is a highly selective single-track international conference
focusing on premier research results at the intersection of embedded
systems and wireless networking - an area of highest relevance for
visionary technologies such as the Internet of Things and
Cyber-Physical Systems as well as applications such as Industry 4.0,
Smart Production, Smart Cities, and Connected Cars.

The featured topic of the 2017 edition of EWSN is dependability in
systems such as Cyber-Physical Systems, Internet of Things, industrial
wireless control networks, smart vehicles, and robots. We specifically
welcome contributions that aim at making these systems more reliable,
predictable, safe, and secure to enable critical applications that
require guaranteed performance. Topics not related to dependability
are equally welcome as long as they fall into scope of the conference,
as described below.

The conference solicits both full technical papers, and short papers
describing validated early ideas. The conference proceedings will
appear in the ACM digital library. New this year is that a specialized
committee will select a subset of the papers appearing at the
conference to be fast-tracked to ACM Transactions on Sensor Networks.

EWSN 2017 welcomes contributions describing original ideas, promising
new concepts, and practical experiences (experimental validation,
rebuttal, and/or comparison of existing approaches) in all relevant
areas of networked embedded systems such as Internet of Things,
Cyber-Physical Systems, and Wireless Sensor Networks and their
applications in domains such as Smart Cities, Industry 4.0 and Smart
Factories, Smart Cars, and Smart Health. Specific topics of interest
include but are not limited to:

Dependability (real-time, reliability, availability, safety, security)
Embedded wireless networking from physical to application layer
Wireless embedded computing platforms
Operating systems, middleware, and services
Programming paradigms, languages, and tools
Distributed and embedded computing for networked systems
Applications, deployment, management, and debugging
Sensing and actuation
Networked embedded sensing in robots and drones
Mobility, localization, tracking
Embedded data management and processing
Interaction with humans
Cloud, back-end integration, and analytics

Please ask the program chairs if you are uncertain if your topic fits.

EWSN 2017 will also host exciting co-located events:

Next Generation Platforms for the Cyber-Physical Internet (NextMote)
http://www.ewsn2017.org/nextmote-workshop.html

MadCom: New Wireless Communication Paradigms for the Internet of Things
http://www.ewsn2017.org/madcom-workshop.html

Dependability Competition
http://www.ewsn2017.org/dependability-competition.html

*Submission instructions*

EWSN 2017 is a highly selective conference. We will only accept for
review original papers that have not been previously published and are
not currently under review by any other conference or journal. We will
adopt a double-blind review process, where the names of authors and
their affiliations are unknown to reviewers until the end of the
review process. We will also provide authors the possibility of a
rebuttal before final decisions are made.

Full paper submissions must have at least 8 and at most 12
pages. Short paper submissions must have at least 4 and at most 6
pages. Pages must have 8.5" x 11" (letter) two-column format, using
10-point type on 11-point leading, with a maximum text block of 7"
wide x 9" deep with an inter-column spacing of .25". The page limits
include figures, tables, and references.

Authors must make a good faith effort to anonymize their submissions
such that the author identities are not disclosed to the
reviewers. Papers that do not meet the size, formatting, and
anonymization requirements may not be reviewed.

The submission site is found at: http://ewsn2017.neslab.it

*Important dates*

Paper registration: September 19th, 2016 AOE (extended)
Paper submission: September 26th, 2016 AOE (extended)
Authors rebuttal deadline: November 19th, 2016 AOE
Notification: December 1st, 2016
Camera-ready: December 21st, 2016

*Program committee *

Luca Mottola, Politecnico di Milano, Italy and SICS Swedish ICT (co-chair)
Chenyang Lu, Washington University in St. Louis, USA (co-chair)

Oliver Amft, University of Passau, Germany
Björn Andersson, CMU, USA
Anish Arora, Ohio State Univ, USA
Iain Bate, University of York, UK
Marcel Baunach, TU Graz, Austria
Giovanni Beltrame, Universitè Polytechnic de Montreal, Canada
Octav Chipara, Iowa State University, USA
Wei Dong, Zhejiang University
Marco Dorigo, Universitè Libre Bruxelles, Belgium
Simon Duquennoy, INRIA/SICS, France
Mo Haghighi, Intel Labs UK
Yuan He, Tsinghua University, China
Wen Hu, University of New South Wales, Australia
JeongGil Ko, Ajou University, Korea
Xiang-Yang Li, University of Science and Technology of China, China
Mike Liang, Microsoft Asia, China
Neal Patwari, University of Utah, USA
Christian Poellabauer, University of Notre Dame, USA
Gian Pietro Picco, University of Trento, Italy
Kay Roemer, TU Graz, Austria
Abusayeed Saifullah, Missouri University of Science and Technology, USA
Mo Sha, State University of New York at Binghamton, USA
Philipp Sommer, ABB, Switzerland
Junehwa Song, Korea Advanced Institute of Science and Technology
Rui Tan, Nanyang University of Technology, Singapore
Lothar Thiele, ETH Zurich, Switzerland
Niki Trigoni, University of Oxford, UK
Guoliang Xing, Michigan State University, USA
Desheng Zhang, Rutgers University, USA

_______________________________________________
Tinyos-devel mailing list
Tinyos-devel@millennium.berkeley.edu
https://www.millennium.berkeley.edu/cgi-bin/mailman/listinfo/tinyos-devel

Reply via email to