NextMote: Next Generation Platforms for the Cyber-Physical Internet
a workshop hosted by
International Conference on Embedded Wireless Systems and Networks
February 20-22, 2017, Uppsala, Sweden

Call for Papers


The hardware for networked embedded systems and Internet of Things
(IoT) has evolved significantly over the last decades. During this
time two major classes of platforms have emerged for network gathering
and processing of sensor data: so called "motes" that are based on a
micro controller and well suited for prototyping and testing
hypotheses and solutions in the field, and smartphones as ubiquitous
and powerful yet mobile communications and computing platforms already
adopted by wide population. However, as the number of devices and
applications continue growing in numbers and reducing in size, novel,
superior platforms should emerge. Let us call these new platforms

This workshop would like to ask the question: what comes after motes
and smartphones for the communication and computation needs in the
world of IoT and remote distributed sensing. What will be the NextMote

Some challenges will remain: prolonging the lifetime of the network
nodes, minimizing the power consumption, providing sufficient
communications and processing power. What are the next challenges and
how to meet them, for example, the challenges due to minimizing the
size of the devices, increasing the number of nodes dramatically, and
sensing large streams of data in resource constrained environment. How
to survive extreme environments and applications while doing no harm,
such as NextMotes on and in the human body, volcano, or space. The
workshop raises these questions in the terms of novel hardware
platform and associate firmware and software design and development,
for prototyping and for end-user systems.


The workshop will consist of a keynote, presentations of short papers
and an open discussion session. The short papers can be of a technical
nature, presenting preliminary results, or position papers presenting
a thought-provoking view regarding architectures, design methods or
tools for the novel NextMote platforms.

The workshop focuses on the aspects related to platform design in the
context of NextMote. Topics covered by the workshop include, but are
not limited to:

+ Modular, multi-core, multi-radio, and reconfigurable architectures
  for NextMote
+ Devices for novel communication: dense, sparse, and directional
+ Pushing NextMote towards battery-less operation: energy harvesting,
  storage, and transfer
+ Pushing the size of NextMote towards "smart dust", ultra-thin, and
+ Unconventional form factors and packaging: wearable, on-body,
  printable NextMotes
+ Surviving extreme environments and leaving no trace: bio-degradable,
  digestible, disposable NextMotes
+ Robust and redundant design for NextMote health, reliability and
  self healing
+ Design, evaluation and profiling tools, and next level testbeds for
+ Hardware assisted security and privacy in resource constrained
+ Low-level software, firmware, operating systems for NextMote
+ Ultra low-cost hardware and deployments at large
+ Active or opportunistic mobility for NextMotes: riding on humans,
  animals, drones, drifting
+ Nature inspired (passive) mobility, NextMotes as seeds or pollen

Submission Instructions
Papers must be submitted online via EasyChair:

Formatting requirements. The papers will be published as part of the
conference proceedings and will appear in the ACM Digital Library. We
encourage submissions from academia and industry alike. The papers can
have a maximum length of 6 pages (two column format).

Pages must have 8.5" x 11" (letter) two-column format, using 10-point
type on 11-point leading, with a maximum text block of 7" wide x 9"
deep with an intercolumn spacing of .25". The page limits include
figures, tables, and references. Authors may use the LaTeX template
ewsn-workshops.tex provided here:

Importand Dates
Paper Submission: October 28, 2016 (extended).
Paper Notification: December 1, 2016.

Workshop chair: 
Leo Selavo, University of Latvia

Program Committee:
Marcel Baunach, TU Graz, Austria
Octav Chipara, University of Iowa, USA
Pai Chou, UC Irvine, USA
Peter Langendorfer, IHP Microelectronics, Germany
Massimo Poncino, Politecnico di Milano, Italy

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