Dear Treggers, Before a product enters the test department, it is put through a thermal cycle of 70 degrees C for 48 hours at full functionality.
Suppose the product fails the burn-in, how many components have to be replaced before the product warrants thermal recycling? For instance, suppose a product has 100 passives to include resistors, capacitors, and inductors. It also has 25 ICs to include 2 u-processors, 4 ROMs, 2 RAMs, 4 framers and various other ICs. It also has semiconductors - 10 npn transistors and 20 diodes. Now the infant mortality rate of the semis is way off from the passives so that one could argue almost complete replacement of the passives warranting no thermal recycling (just using this as an example). But, how many of the semis and of which type would YOU have to replace to warrant recycling? I don't have any good answer for this so if those of us would enter into a discussion, I would appreciate it. Offline discussion is invited also... mailto: [email protected] Regards ...
