Anyone have a suggestion for spacings (creepage distances) of traces both inner and outer layers of a PC board for compliance with ANY domestic/international T1/E1 telco standard?
I'm primarily concerned with each of the test setups and the associated voltages for each test setup. In other words, we aren't using the creepage/clearance tables of say UL-1950 3rd Ed. to determine the distances, or are we? Regards, Doug
