On 12.02.20 09:15, Weijie Gao wrote:
On Wed, 2020-02-12 at 08:55 +0100, Stefan Roese wrote:
Hi Weijie,
On 12.02.20 08:49, Weijie Gao wrote:
This patch adds SPL support for mtmips platform. The lowlevel architecture
is split into SPL and the rest parts are built into a memory loadable
u-boot image. Optional SPL_DM and OF_CONTROL are also supported.
The increment of size is very small (< 10 KiB) if SPL_DM and OF_CONTROL are
not enabled and the memory bootable u-boot (u-boot.img) is generated
automatically so there is not need to add a separate config for it.
A lzma compressed payload (u-boot-lzma.img) is also generated and it will
be combined with u-boot-spl.bin to form the unified ROM bootable binary
u-boot-mtmips.bin.
A spl loader is added to support uncompress the payload.
Reviewed-by: Stefan Roese <[email protected]>
Signed-off-by: Weijie Gao <[email protected]>
---
Changes since v3: rename output file to u-boot-mips.bin
Hmm, why did you change it this way? Did you read my comment about this
combined image name from yesterday? I would really prefer to use the
already repsent and know image name "u-boot-with-spl.bin", which is used
by many other platforms already as a combined image with SPL + U-Boot
proper.
Is there a reason why we should not use this generic image name instead
of this newly created one?
I forgot there is already no padding between spl and u-boot payload, and
u-boot-with-spl.bin is ok to replace u-boot-mtmips.bin.
I didn't choose u-boot-with-spl.bin for the previous patches because spl
needs padding, and Simon Glass suggested to use binman[1].
Since padding is no longer needed, I will send the next patch series
using u-boot-with-spl.bin.
If its just this change, then a follow-up patch should be enough to not
"spam" the list too much. If you need to send a v5, then sure, please
fold this change into this patch there.
Thanks,
Stefan
