dwc3-sti-glue has been broken since MISC uclass has been
modified to scan DT sub-nodes after bind.
Fixing it by a using the no-op uclass.
Signed-off-by: Patrice Chotard <patrice.chot...@st.com>
---
drivers/usb/host/dwc3-sti-glue.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/usb/host/dwc3-sti-glue.c b/drivers/usb/host/dwc3-sti-glue.c
index ad7cf6e6b53d..f25e1dc6640c 100644
--- a/drivers/usb/host/dwc3-sti-glue.c
+++ b/drivers/usb/host/dwc3-sti-glue.c
@@ -245,7 +245,7 @@ static const struct udevice_id sti_dwc3_glue_ids[] = {
U_BOOT_DRIVER(dwc3_sti_glue) = {
.name = "dwc3_sti_glue",
- .id = UCLASS_MISC,
+ .id = UCLASS_NOP,
.of_match = sti_dwc3_glue_ids,
.ofdata_to_platdata = sti_dwc3_glue_ofdata_to_platdata,
.probe = sti_dwc3_glue_probe,
--
2.17.1
