On 4/4/23 7:13 AM, Neha Malcom Francis wrote:
By providing entries in the binman node of the device tree, binman will
be able to find and package board config artifacts generated by
TIBoardConfig with sysfw.bin and generate the final image sysfw.itb.
It will also pick out the R5 SPL and sign it with the help of TI signing
entry and generate the final tiboot3.bin.
Entries for A72 build have been added to k3-j721e-binman.dtsi to
generate tispl.bin and u-boot.img.
Support has been added for both HS(SR 1.1) and GP images where the
encrypted system firmware binary must be signed along with the signed
certificate binary.
tiboot3.bin and sysfw-j721e_sr1_1-hs.itb: For HS devices
tiboot3.bin_unsigned and sysfw-j721e-gp-evm.itb: For GP devices
<filename>.bin/img: For HS devices
<filename>.bin_unsigned/img_unsigned: For GP devices
Intention of patch is to move signing and packaging to binman,
thus making makefile target only if binman is not enabled.
It is to be noted that the bootflow followed by J721E requires:
tiboot3.bin:
* R5 SPL
* R5 SPL dtbs
sysfw.itb:
* TIFS
* board-cfg
* pm-cfg
* sec-cfg
* rm-cfg
tispl.bin:
* DM
* ATF
* OPTEE
* A72 SPL
* A72 SPL dtbs
u-boot.img:
* A72 U-Boot
* A72 U-Boot dtbs
Signed-off-by: Neha Malcom Francis <n-fran...@ti.com>
---
[...]
+ ti_fs_cert: ti-fs-cert.bin {
+ filename = "ti-fs-firmware-j721e_sr1_1-hs-cert.bin";
Suggest prefix these with the expected directory name,
filename = "ti-sysfw/ti-fs-firmware-j721e_sr1_1-hs-cert.bin";
that way we only need to do one simple firmware path export:
export BINMAN_INDIRS="<ti-linux-firmware>"
Same below for DM firmware which lives in the same firmware repo but in
a directory that depends on the platform, selecting the correct platform
directory here in this file makes it so much easier for users.
[...]
+ filename = "ipc_echo_testb_mcu1_0_release_strip.xer5f";
filename = "ti-dm/j721e/ipc_echo_testb_mcu1_0_release_strip.xer5f";
Do that for all the DM/SYSFW files for all the platforms in this series.
Thanks,
Andrew
