Hi Anshul,
On 2026-07-17T10:42:51, Anshul Dalal <[email protected]> wrote:
> arm: dts: k3-am625: add template for tispl.bin
>
> This patch addresses the duplication of the binman nodes responsible for
> generating tispl.bin and tispl.bin_unsigned for TI's AM625 SoC based
> boards.
>
> The common nodes are factored out into a template in the SoC level
> k3-am625-binman.dtsi that each board in-turn includes.
>
> No functional change is intended from the patch asides from the addition
> of tifsstub-hs and tifsstub-fs nodes in beagleplay's tispl.bin which
> should have no consequence asides from growing the binary size by few
> kilo bytes.
>
> Signed-off-by: Anshul Dalal <[email protected]>
>
> arch/arm/dts/k3-am625-beagleplay-u-boot.dtsi | 92 +------
> arch/arm/dts/k3-am625-binman.dtsi | 240 ++++++++++++++++++
> arch/arm/dts/k3-am625-phycore-som-binman.dtsi | 241 +-----------------
> arch/arm/dts/k3-am625-sk-binman.dtsi | 288
> ++--------------------
> arch/arm/dts/k3-am625-verdin-wifi-dev-binman.dtsi | 185 +-------------
> 5 files changed, 270 insertions(+), 776 deletions(-)
> diff --git a/arch/arm/dts/k3-am625-beagleplay-u-boot.dtsi
> b/arch/arm/dts/k3-am625-beagleplay-u-boot.dtsi
> @@ -63,99 +63,11 @@
> ti-spl_unsigned {
> - filename = "tispl.bin_unsigned";
> + insert-template = <&ti_spl_unsigned_am625_template>;
> symlink = "tispl.bin";
> - pad-byte = <0xff>;
> -
> fit {
> - description = "Configuration to load ATF and SPL";
> - #address-cells = <1>;
> -
> images {
Just to check: the FIT for beagleplay now also contains tifsstub-hs /
tifsstub-fs entries even though conf-0's loadables only references
tifsstub-gp. Have you confirmed that the resulting tispl.bin still
parses cleanly and SPL does not try to load the unused entries? Please
note the beagleplay boot test in the commit message.
I was unable to try this in my lab:
arm: + am62x_beagleplay_r5
+binman: Node '/binman/tiboot3-am62x-gp-evm.bin/ti-secure-rom': Cannot
find node for phandle 100
+make[1]: *** [Makefile:1410: .binman_stamp] Error 1
+make: *** [Makefile:189: __sub-make] Error 2
> diff --git a/arch/arm/dts/k3-am625-binman.dtsi
> b/arch/arm/dts/k3-am625-binman.dtsi
> @@ -121,3 +121,243 @@
> +#ifdef CONFIG_ARM64
> +
> +&binman {
> + tifsstub-hs {
The three tifsstub-{hs,fs,gp} nodes are unconditional within the
CONFIG_ARM64 block, so every A53 board including this dtsi will
produce tifsstub.bin_hs / _fs / _gp regardless of variant. That is
fine since the blobs are optional, but please confirm this is intended
and does not regress packaging scripts that consume these artefacts.
> diff --git a/arch/arm/dts/k3-am625-sk-binman.dtsi
> b/arch/arm/dts/k3-am625-sk-binman.dtsi
> @@ -392,16 +155,15 @@
> };
> };
> };
> -
> &binman {
> u-boot_unsigned {
Please keep the blank line before &binman - the file is easier to scan
with the separators intact.
Regards,
Simon
