*Title : Windows Engg- Application Packaging lead* * Location : NYC, NY*
* Duration : 12+ Months* * Mode of Interview : Telephonic + Face2Face* *Experience – 5 – 8 years* *Technical skill sets – * • Good Client coordination • Knowledge of Windows 7 Desktop administration • Knowledge of Powershell or VB Scripting will be advantage • Knowledge of Application deployment • Knowledge of Application life cycle management will be advantage • Knowledge of Application Packaging with Admin Studio • Very strong Troubleshooting and Technical skills. • Must be able to help team Technically for the escalated issues. • Knowledge of various project software like Powerpoint/Project/Visio *Regards,* Amit Sharma Sr. Technical Recruiter IDC Technologies Inc. 1851 McCarthy Blvd Milpitas, CA 95035 *Call: *408-457-9381 *Ext.* 4011 | *IM:* amitsharma.rgtalent (Gtalk/YIM) *Email:** [email protected] <[email protected]> * *Website:* www.idctechnologies.com -- You received this message because you are subscribed to the Google Groups "US_IT.Groups" group. To unsubscribe from this group and stop receiving emails from it, send an email to [email protected]. To post to this group, send email to [email protected]. Visit this group at http://groups.google.com/group/us_itgroups. For more options, visit https://groups.google.com/d/optout.
