We have only tested bonded interface in mode 2 with VPP and not with other modes. For mode 4 (which I assume is what you are asking about for LACP), I am not sure VPP behavior fit the DPDK mode 4 requirement for polling interval and buffer size.
Regards, John From: Bernier, Daniel (520165) [mailto:daniel.bern...@bell.ca] Sent: Friday, October 14, 2016 1:57 PM To: John Lo (loj) Cc: vpp-dev@lists.fd.io Subject: Re: bond interfaces in VPP Thanks As any work been done on the other modes (ie lacp) ? Thanks Daniel Bernier Sent from my iphone On Oct 6, 2016, at 4:03 PM, John Lo (loj) <l...@cisco.com<mailto:l...@cisco.com>> wrote: Yes, bonded interface is supported in VPP using the DPDK Link Bonding PMD library. One can specify slave links to the bonded interface in the VPP startup file, in the DPDK section: https://wiki.fd.io/view/VPP/Command-line_Arguments#.22dpdk.22_parameters Regards, John From: vpp-dev-boun...@lists.fd.io<mailto:vpp-dev-boun...@lists.fd.io> [mailto:vpp-dev-boun...@lists.fd.io] On Behalf Of Bernier, Daniel (520165) Sent: Thursday, October 06, 2016 3:40 PM To: vpp-dev@lists.fd.io<mailto:vpp-dev@lists.fd.io> Subject: [vpp-dev] bond interfaces in VPP Hi, Has anyone tried tying a bond interface to VPP? If so, any performance impact ? Thanks Dan B
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