Internet of Things International Conference 2017
"Building the IoT: Critical Device-Level Technologies"
Speaking, delegate and sponsorship opportunities available
The inaugural IoT International conference 2017 will provide an in-depth
understanding of IoT device-level design requirements, system on chip (SoC)
needs, protocols, networks, security and sensor development. Most importantly,
the program will reveal ways that a company and products may be part of the IoT
opportunity. The presentations are divided into five key themes which
collectively provide complete coverage of building the IoT from a critical
device-level technologies perspective.
Five key industry themes - 25 inspiring presentations - Save the date!
• Device technologies and the IoT business
• IoT sensors
• IoT security
• IoT device-level R&D, manufacturing and supply chain
• IoT diversity: The billion dollar 'niche'
Co-located with and
These 2-day events will see 3 groups of device makers gathered under one roof.
During networking everyone will have the opportunity to connect with each
other. We expect over 500+ delegates who can attend any one of the 95
presentations on offer.
87 speakers CONFIRMED and in place so far.
IoT International
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Speakers include: IHS Markit, Qorvo, CommSolid GmbH, Weightless SIG, IHS Markit
Sensors, Advanced Epi Materials and Devices, imec, Intrinsic-ID B.V., Lux
Research, Wirepas Pino, oneM2M, Kinetics, The Alliance for Internet of Things
Innovation (AIOTI), Texas Instruments Benelux B.V, Evertracker GmbH, Enfucell
Oy, Xilinx, IBM Watson, Gemalto, Versasense;
and more to come.
CS International
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Speakers include: Skyworks, FLOSFIA, VisIC, Exagan, ARPA-E, Monolith, FINsix,
Wolfspeed, Sanan Optoelectronics, Philips Lumileds Lighting, OSRAM, Sony, WIN
Semiconductors, DARPA, MIT, IBM, Institute of Microelectronics of Chinese
Academy of Sciences, Murata Manufacturing, EpiGaN, Seren Photonics, Yole
Développement, Teledyne Technologies, University of Rome Tor Vergata,
Wolfspeed, MACOM, Evatec, Nanyang Technological University, imec, Aixtron,
Ferrotec, Nanotronics, Panasonic, Advanced Epi Materials and Devices.
PIC International
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Speakers include: Infinera, Ciena, Huawei Technologies, Oclaro, Seagate, Intel
Corporation, Kaiam, LioniX International, POET Technologies, Luxtera, Cadence
Design Systems, University of Southampton, Hewlett Packard Enterprise, Gent
University, VTT Technical Research Centre of Finland, Phosnet Research Group -
Aristotle University of Thessaloniki, LIGENTEC, Fraunhofer HHI, Tyndall
National Institute, VPIphotonics, Technobis group, imec, European Space Agency,
PhotonDelta, MIT.
Be a part of it - speaking and sponsoring opportunities available
Speaking opportunities:Contact Jackie Cannon
<mailto:jackie.can...@angelbc.com>
Sponsorship information:mediapack.iotinternational.net
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Early bird registration:www.iotinternational.net/register
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The sponsor packages provide companies with an influential industry platform to
educate and penetrate the global industry by a multitude of marketing methods.
Europe & Asia
Jackie Cannon - Event Director
Tel: +44 (0)1923 690 200
Email: jackie.can...@angelbc.com
<mailto:jackie.can...@angelbc.com>
USA
Janice Jenkins - Account Manager
Tel: +1 724 929-3550
Email: jjenk...@brunmedia.com
<mailto:jjenk...@brunmedia.com>
From the publishers/organisers of
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