Hi Brad,

Given it's a balloon payload, what are your mass constraints?  Conductive
cooling is going to involve throwing metal at the problem, possibly a lot
of metal...

-Francois


On Tue, Apr 16, 2013 at 12:57 PM, Steve Maher <stephen.f.ma...@nasa.gov>wrote:

> Heatpipes and dunking <http://www.pugetsystems.com/submerged.php>in
> liquid (e.g. mineral oil) are options we've explored (with PCs), although
> we seem to be favoring pressure vessels at this point.
>
> Steve
>
>
> On Tue, Apr 16, 2013 at 2:34 AM, Jason Manley <jman...@ska.ac.za> wrote:
>
>> I don't know of anyone who's actually done this, but we do also have a
>> passive-cooled concept for our new digitiser board (loosely based on
>> ROACH2). We've been thinking about a prototype that'd essentially be
>> turning a ROACH2 board upside-down and bolting it onto a giant metal plate
>> that's been appropriately milled out of a solid chunk of alu. The FPGA,
>> PPC, QDR and other hot bits would make contact with the plate and use it as
>> heatsink. The other high-profile parts (RAM DIMM, for example) needs holes
>> or cavities milled out the alu.
>>
>> I think Vaughan (cc'd here) might have some mechanical drawings of ROACH2
>> with the holes and things in the appropriate place. It might help you get
>> started. He could also provide some CFD models and heat load measurements
>> of the various components.
>>
>> Jason Manley
>> DSP Specialist
>> SKA-SA
>>
>> Cell: +27 82 662 7726
>> Work: +27 21 506 7300
>>
>> On 15 Apr 2013, at 20:29, Brad Dober wrote:
>>
>> > Dear Casper Collaboration Members,
>> >
>> > My name is Brad Dober, and I'm a grad student at UPenn working on a
>> ROACH-based MKID readout for a balloon payload. At our float altitude,
>> air-cooling the ROACH and ADC/DACs isn't feasible Has any other group
>> looked into or even designed a conduction-cooled system for .either the
>> ROACH1 or ROACH2?
>> >
>> > Any leads would be extremely helpful.
>> >
>> > Sincerely,
>> >
>> > Brad Dober
>> > Ph.D. Candidate
>> > Department of Physics and Astronomy
>> > University of Pennsylvania
>> > Cell: 262-949-4668
>>
>>
>>
>


-- 
Francois Kapp

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