Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread bruce
http://www.ham-radio.com/wa6vhs/Test%20equipment/FREQUENCY%20STANDARDS/FE-5680A/fei%205680a.pdf
has high quality images of the 5680A and 5650A internal electronics.

Bruce

Hi,
some light might be shed on the heatsink problem by reading the data  
sheet for the LPRO 101 (Symmetricom)
The units will have similar issues to cope with.
The LPRO has temperature controlled lamp and filter, at different  
temperatures above 80C.
Its power consumption is shown in a chart and is reduced as the  
temperature rises because the heating power needed becomes less.
It must have a 17V internal series regulator, because total power  
consumption falls down to the minimum of 18V.
MTBF is listed as 380kh at 20C, 320kh at 30C, 253kh at 40C, 189k at  
50C and 134k at 60C.
These are values that you would expect for most solid state boards.
My solution was to put the device onto a finned heat sink in an  
aluminum box with a tiny 12V brushless fan, (40mm)
which runs on 8 volts and is switched by a thermistor in the heatsink  
to keep the baseplate at 40C.
This seems to be a good trade-off with MTBF, and the 10 MHZ xtal will  
run at a constant temperature of 40C + or - 0.05.
I have not yet assembled the gear to measure how much its performance  
is improved.
cheers, Neville Michie


On 09/06/2009, at 2:18 PM, Mark Sims wrote:



 Also see my post from June of last year where I had measured the  
 heat sink rise over ambient of several rubidium oscillators in free  
 air...  the FEI-5650 was very close to it's operating limit if  
 operated in free air and not attached to something:
 http://www.febo.com/pipermail/time-nuts/2008-June/031695.html

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Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread Bruce Griffiths
Leigh

Leigh L. Klotz, Jr WA5ZNU wrote:
 Chuck,
 This device is a pull from a larger system, probably a cell site. 
 It's clearly designed to be mounted on something, as it has lots and
 lots of holes around the edge.  I suspect there's some thermal
 management that's missing.  The FEI sheet gives typical data for the
 0-50C range, though presumably that's ambient temperature.
 I don't want to cool the physics package per se, but I do want to at
 least approximate what kind of thermal solution ought to be supplied.

 Quite a few of these have been sold, and I've gotten good advice from
 others on this list about calibration.  I'd hoped that someone would
 have experience with the thermal management.

 So far I've seen
 http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf

 which shows (but doesn't describe) a heat sink on the bottom.


If the case is Mu metal or similar then the  modification shown in the
above article will likely destroy its magnetic shielding properties
(unless its annealed in a hydrogen atmosphere at 400C for several hours
after machining).
The unit is designed like competitive units to be bolted to a heatsink
or panel. The trick being to maintain the baseplate temperature within
the specified temperature range (-5C to +50C).
Since the power dissipation is low (11W @ 25C) you wont need an
extremely low thermal resistance heatsink unless your ambient
temperature is relatively high. If the ambient temperature is 40C then a
1C/W heatsink should maintain the base plate temperature below 60C.

Just mount the 5680A on your heatsink and monitor the steady state
heatsink temperature (with a thermocouple, RTD or other contact
thermometer - could even use photochromic temperature sensing strips)
both with the FE5680A upside down and the right way up.
The infrared thermometer is unreliable unless its reading is corrected
for the emissivity of the target in the 20um infrared region.

Bruce
 Leigh.

 I'm puzzled.  I admit that I don't have a lot of experience with
 Rb standards, but I do have a bit of experience with the HP-5065A
 Rb standard.

 In the 5065A, the entire physics package is enclosed in an oven.

 Assuming that your Rb is the same, and I believe it is, your plan
 to force the physics package to run at room temperature is just going
 to make the oven work harder in its never ending quest to maintain
 stable temperature.  If you monitor the current draw of the 5680A,
 you will probably see that it goes up when you put a fan on it.

 Sometimes, you just have to let electronics run hot.

 What did the manufacturer suggest?

 -Chuck Harris

 Leigh L. Klotz, Jr WA5ZNU wrote:
 I've attached an SMA connector to my FE-5680A and built an external
 linear power supply with a TO-3 7815.

 I ran the device today for about half an hour, and used an infrared
 sensing thermometer to measure the external case temperature.
 It got up to 48 C externally in the physics package area.
 I put a muffin fan on top and it brought it down to 38C but I don't
 think this is a good plan because I worry about the effects of the
 fan's magnetic field on the Rubidium system.
 I found in my junk box a finned Aluminum heat sink that's exactly
 the same size as the FE-5680A and plan to tap it around the edges
 for 4-40 hardware to attach to the many screw holes.  Even so, this
 heat sink will be on the bottom, so the FE-5680A will have to be
 operated upside down for this to help.

 Has anybody got good thermal management solution for this device? 
 This is the one currently selling on eBay in the 25x88x125mm chassis.

 Thanks,
 Leigh.


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Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread Bruce Griffiths
Leigh

Leigh L. Klotz, Jr WA5ZNU wrote:

  Chuck,
  This device is a pull from a larger system, probably a cell site. 
  It's clearly designed to be mounted on something, as it has lots and
  lots of holes around the edge.  I suspect there's some thermal
  management that's missing.  The FEI sheet gives typical data for the
  0-50C range, though presumably that's ambient temperature.
  I don't want to cool the physics package per se, but I do want to at
  least approximate what kind of thermal solution ought to be supplied.
 
  Quite a few of these have been sold, and I've gotten good advice from
  others on this list about calibration.  I'd hoped that someone would
  have experience with the thermal management.
 
  So far I've seen
  http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf
 
  which shows (but doesn't describe) a heat sink on the bottom.
 
   

If the case is Mu metal or similar then the  modification shown in the
above article will likely destroy its magnetic shielding properties
(unless its annealed in a hydrogen atmosphere at 400C for several hours
after machining).
The unit is designed like competitive units to be bolted to a heatsink
or panel. The trick being to maintain the baseplate temperature within
the specified temperature range (-5C to +50C).
Since the power dissipation is low (11W @ 25C) you wont need an
extremely low thermal resistance heatsink unless your ambient
temperature is relatively high. If the ambient temperature is 40C then a
1C/W heatsink should maintain the base plate temperature below 60C.

Just mount the 5680A on your heatsink and monitor the steady state
heatsink temperature (with a thermocouple, RTD or other contact
thermometer - could even use photochromic temperature sensing strips)
both with the FE5680A upside down and the right way up.
The infrared thermometer is unreliable unless its reading is corrected
for the emissivity of the target in the 20um infrared region.

Bruce

  Leigh.
 
   
  I'm puzzled.  I admit that I don't have a lot of experience with
  Rb standards, but I do have a bit of experience with the HP-5065A
  Rb standard.
 
  In the 5065A, the entire physics package is enclosed in an oven.
 
  Assuming that your Rb is the same, and I believe it is, your plan
  to force the physics package to run at room temperature is just going
  to make the oven work harder in its never ending quest to maintain
  stable temperature.  If you monitor the current draw of the 5680A,
  you will probably see that it goes up when you put a fan on it.
 
  Sometimes, you just have to let electronics run hot.
 
  What did the manufacturer suggest?
 
  -Chuck Harris
 
  Leigh L. Klotz, Jr WA5ZNU wrote:
 
  I've attached an SMA connector to my FE-5680A and built an external
  linear power supply with a TO-3 7815.
 
  I ran the device today for about half an hour, and used an infrared
  sensing thermometer to measure the external case temperature.
  It got up to 48 C externally in the physics package area.
  I put a muffin fan on top and it brought it down to 38C but I don't
  think this is a good plan because I worry about the effects of the
  fan's magnetic field on the Rubidium system.
  I found in my junk box a finned Aluminum heat sink that's exactly
  the same size as the FE-5680A and plan to tap it around the edges
  for 4-40 hardware to attach to the many screw holes.  Even so, this
  heat sink will be on the bottom, so the FE-5680A will have to be
  operated upside down for this to help.
 
  Has anybody got good thermal management solution for this device? 
  This is the one currently selling on eBay in the 25x88x125mm chassis.
 
  Thanks,
  Leigh.
 
 
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[time-nuts] FE-5680A heat sink

2009-06-09 Thread Murray Greenman
I think we've all learned from this. Good info about the Efratom unit,
and sounds as though we should aim for around 38C with the FEI units as
well. The FE-5680 looks to be easier to deal with than the FE-5650, so
I'll look into that first.

Murray ZL1BPU


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Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread Bruce Griffiths
Murray Greenman wrote:
 I think we've all learned from this. Good info about the Efratom unit,
 and sounds as though we should aim for around 38C with the FEI units as
 well. The FE-5680 looks to be easier to deal with than the FE-5650, so
 I'll look into that first.

 Murray ZL1BPU


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For those who haven't found it here is a link to a manual for one
version of the 5680A:

http://www.ham-radio.com/wa6vhs/Test%20equipment/FREQUENCY%20STANDARDS/FE-5680A/5680%20TECH%20MANUAL.pdf


Bruce

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Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread Leigh L. Klotz, Jr WA5ZNU

Yes, thank you to all.

I'll go ahead with the heat sink on the bottom and consider a fan nearby.

Leigh/WA5ZNU

I think we've all learned from this. Good info about the Efratom unit,
and sounds as though we should aim for around 38C with the FEI units as
well. The FE-5680 looks to be easier to deal with than the FE-5650, so
I'll look into that first.

Murray ZL1BPU


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Re: [time-nuts] FE-5680A heat sink

2009-06-09 Thread Leigh L. Klotz, Jr WA5ZNU

Bruce,
Thank you for this point.  I've seen Mu metal competitors but I can't 
tell what the case is made from.
Pretty much everybody I've seen on this has had to make some kind of 
allowance for getting the RF out.
I drilled a hole for an SMA connector and had it exit on the digital 
half of the chassis (not the physics half), as they're separated by a 
very large bar, perhaps brass.  It has a few ways to get wires through, 
but it didn't seem to be a good idea.


The SMA is a jumper I bought on eBay from a Chinese manufacturer, with 
an IPX connector on one end and the SMA bulkhead on the other.
Hirose U.Fl and IPX are said to be compatible, but it didn't look like 
it wanted to stay down, so I tacked a wire to the head of the IPX 
connector put a brass 2-54 nut on a nearby post to ensure mechanical 
connection.  I think this is better than soldering open coax to the 
connector, but given the short size and low frequency (10 Mhz) it's 
probably not a concern.


So, I probably did something bad to the magic Mu metal annealing by 
drilling a hole, but it's as far as I could get over on the digital side 
of the brass divider.   At this point I have nothing calibrated that I 
can measure the device with and see if there's any small magnetic 
influence, but perhaps someday I will, or maybe someone else would like 
to compare with another device sometime.


It might have been possible to re-purpose a pin from the existing RS232 
connector, and perhaps others who buy this same run of device may want 
to investigate that.


Leigh.


Bruce Griffiths wrote:

Leigh L. Klotz, Jr WA5ZNU wrote:
  

So far I've seen
http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf




If the case is Mu metal or similar then the  modification shown in the
above article will likely destroy its magnetic shielding properties
(unless its annealed in a hydrogen atmosphere at 400C for several hours
after machining).

  



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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Chuck Harris

I'm puzzled.  I admit that I don't have a lot of experience with
Rb standards, but I do have a bit of experience with the HP-5065A
Rb standard.

In the 5065A, the entire physics package is enclosed in an oven.

Assuming that your Rb is the same, and I believe it is, your plan
to force the physics package to run at room temperature is just going
to make the oven work harder in its never ending quest to maintain
stable temperature.  If you monitor the current draw of the 5680A,
you will probably see that it goes up when you put a fan on it.

Sometimes, you just have to let electronics run hot.

What did the manufacturer suggest?

-Chuck Harris

Leigh L. Klotz, Jr WA5ZNU wrote:
I've attached an SMA connector to my FE-5680A and built an external 
linear power supply with a TO-3 7815.


I ran the device today for about half an hour, and used an infrared 
sensing thermometer to measure the external case temperature.

It got up to 48 C externally in the physics package area.
I put a muffin fan on top and it brought it down to 38C but I don't 
think this is a good plan because I worry about the effects of the fan's 
magnetic field on the Rubidium system.
I found in my junk box a finned Aluminum heat sink that's exactly the 
same size as the FE-5680A and plan to tap it around the edges for 4-40 
hardware to attach to the many screw holes.  Even so, this heat sink 
will be on the bottom, so the FE-5680A will have to be operated upside 
down for this to help.


Has anybody got good thermal management solution for this device?  This 
is the one currently selling on eBay in the 25x88x125mm chassis.


Thanks,
Leigh.


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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Poul-Henning Kamp
In message 4a2cfce2.5020...@erols.com, Chuck Harris writes:

 I ran the device today for about half an hour, and used an infrared 
 sensing thermometer to measure the external case temperature.

Be very careful about trusting this:  you need to do some tricky
calibrations to get anywhere near precise when you measure metal
surfaces.

The easy way, is to put a piece of duc[kt]tape on the metal surface
and make sure your thermometer can see only that surface.

Unfortunately, the tape will also act as insulation, so the result
you get is not precise even then.

 It got up to 48 C externally in the physics package area.

That's quite normal.

Those small Rb's keep the internal temperature constant using
heaters, which can raise the temperature and by being able to dump
excess heat through their heat-sink to lower the temperature.

You shouldn't run your Rb too hot, as this decreases the electronics
lifetime and reduces the wiggle-room of the thermal management
inside the device.

On the other hand, cooling it too much will only increase the
power drain for the heaters and increase the thermal gradients
inside the unit, likely degrading thermal stability.

Poul-Henning

-- 
Poul-Henning Kamp   | UNIX since Zilog Zeus 3.20
p...@freebsd.org | TCP/IP since RFC 956
FreeBSD committer   | BSD since 4.3-tahoe
Never attribute to malice what can adequately be explained by incompetence.

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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Chuck Harris

Hi Poul,

By replying to my reply to Leigh, and clipping out everything
that I wrote (but my name), you seem to be attributing to me,
what Leigh wrote.

You then rephrased my statement about heaters in the physics
package, restated my statement about extra cooling increasing
the power drawn by the heaters.

You then clarified things greatly by advising to not run the Rb
too hot, but also don't cool it too much.

???

If you have so much to say to the original author, and nothing to
say about my reply, wouldn't it have been be better to just reply
to his message, instead of mine?

-Chuck Harris

Poul-Henning Kamp wrote:

In message 4a2cfce2.5020...@erols.com, Chuck Harris writes:

I ran the device today for about half an hour, and used an infrared 
sensing thermometer to measure the external case temperature.


Be very careful about trusting this:  you need to do some tricky
calibrations to get anywhere near precise when you measure metal
surfaces.

The easy way, is to put a piece of duc[kt]tape on the metal surface
and make sure your thermometer can see only that surface.

Unfortunately, the tape will also act as insulation, so the result
you get is not precise even then.


It got up to 48 C externally in the physics package area.


That's quite normal.

Those small Rb's keep the internal temperature constant using
heaters, which can raise the temperature and by being able to dump
excess heat through their heat-sink to lower the temperature.

You shouldn't run your Rb too hot, as this decreases the electronics
lifetime and reduces the wiggle-room of the thermal management
inside the device.

On the other hand, cooling it too much will only increase the
power drain for the heaters and increase the thermal gradients
inside the unit, likely degrading thermal stability.

Poul-Henning



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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Poul-Henning Kamp
In message 4a2d129c.3060...@erols.com, Chuck Harris writes:

If you have so much to say to the original author, and nothing to
say about my reply, wouldn't it have been be better to just reply
to his message, instead of mine?

What can I say ?   It was early in the morning ?

See also:  my .sig 

:-)

Poul-Henning


-- 
Poul-Henning Kamp   | UNIX since Zilog Zeus 3.20
p...@freebsd.org | TCP/IP since RFC 956
FreeBSD committer   | BSD since 4.3-tahoe
Never attribute to malice what can adequately be explained by incompetence.

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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Chuck Harris

Hi Poul,

I have long espoused that one should never attribute to malice
that which can be more easily explained by ignorance.  So, I didn't
believe malice was involved.

I just found your post curious, that's all.

I'm pretty sure that mornings should be banned.

-Chuck Harris



Poul-Henning Kamp wrote:

In message 4a2d129c.3060...@erols.com, Chuck Harris writes:


If you have so much to say to the original author, and nothing to
say about my reply, wouldn't it have been be better to just reply
to his message, instead of mine?


What can I say ?   It was early in the morning ?

See also:  my .sig 


:-)

Poul-Henning




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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread M. Warner Losh
In message: 4a2d60a2.3030...@erols.com
Chuck Harris cfhar...@erols.com writes:
: I'm pretty sure that mornings should be banned.

Perty much...  Nobody has a breathalizer to ensure that you are
sufficiently caffeinated to give a good chance of a coherent reply :)
Lord know that would have saved me much embarrassment over the
years...

However, since this is time-nuts, and we do deal with things on the
hairy edge of what is possible, I'm sure someone will point to a side
project that they've done that does just this, with schematics
available for download form their web site :)

Warner

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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Leigh L. Klotz, Jr WA5ZNU

Chuck,
This device is a pull from a larger system, probably a cell site.  It's 
clearly designed to be mounted on something, as it has lots and lots of 
holes around the edge.  I suspect there's some thermal management that's 
missing.  The FEI sheet gives typical data for the 0-50C range, though 
presumably that's ambient temperature. 

I don't want to cool the physics package per se, but I do want to at 
least approximate what kind of thermal solution ought to be supplied.


Quite a few of these have been sold, and I've gotten good advice from 
others on this list about calibration.  I'd hoped that someone would 
have experience with the thermal management.


So far I've seen 
http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf

which shows (but doesn't describe) a heat sink on the bottom.

Leigh.


I'm puzzled.  I admit that I don't have a lot of experience with
Rb standards, but I do have a bit of experience with the HP-5065A
Rb standard.

In the 5065A, the entire physics package is enclosed in an oven.

Assuming that your Rb is the same, and I believe it is, your plan
to force the physics package to run at room temperature is just going
to make the oven work harder in its never ending quest to maintain
stable temperature.  If you monitor the current draw of the 5680A,
you will probably see that it goes up when you put a fan on it.

Sometimes, you just have to let electronics run hot.

What did the manufacturer suggest?

-Chuck Harris

Leigh L. Klotz, Jr WA5ZNU wrote:
I've attached an SMA connector to my FE-5680A and built an external 
linear power supply with a TO-3 7815.


I ran the device today for about half an hour, and used an infrared 
sensing thermometer to measure the external case temperature.

It got up to 48 C externally in the physics package area.
I put a muffin fan on top and it brought it down to 38C but I don't 
think this is a good plan because I worry about the effects of the 
fan's magnetic field on the Rubidium system.
I found in my junk box a finned Aluminum heat sink that's exactly the 
same size as the FE-5680A and plan to tap it around the edges for 
4-40 hardware to attach to the many screw holes.  Even so, this heat 
sink will be on the bottom, so the FE-5680A will have to be operated 
upside down for this to help.


Has anybody got good thermal management solution for this device?  
This is the one currently selling on eBay in the 25x88x125mm chassis.


Thanks,
Leigh.


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the instructions there.



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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Steve Rooke
Calm down Chuck, your doing it again.

2009/6/9 Chuck Harris cfhar...@erols.com:
 Hi Poul,

 By replying to my reply to Leigh, and clipping out everything
 that I wrote (but my name), you seem to be attributing to me,
 what Leigh wrote.

 You then rephrased my statement about heaters in the physics
 package, restated my statement about extra cooling increasing
 the power drawn by the heaters.

 You then clarified things greatly by advising to not run the Rb
 too hot, but also don't cool it too much.

 ???

 If you have so much to say to the original author, and nothing to
 say about my reply, wouldn't it have been be better to just reply
 to his message, instead of mine?

 -Chuck Harris

 Poul-Henning Kamp wrote:

 In message 4a2cfce2.5020...@erols.com, Chuck Harris writes:

 I ran the device today for about half an hour, and used an infrared
 sensing thermometer to measure the external case temperature.

 Be very careful about trusting this:  you need to do some tricky
 calibrations to get anywhere near precise when you measure metal
 surfaces.

 The easy way, is to put a piece of duc[kt]tape on the metal surface
 and make sure your thermometer can see only that surface.

 Unfortunately, the tape will also act as insulation, so the result
 you get is not precise even then.

 It got up to 48 C externally in the physics package area.

 That's quite normal.

 Those small Rb's keep the internal temperature constant using
 heaters, which can raise the temperature and by being able to dump
 excess heat through their heat-sink to lower the temperature.

 You shouldn't run your Rb too hot, as this decreases the electronics
 lifetime and reduces the wiggle-room of the thermal management
 inside the device.

 On the other hand, cooling it too much will only increase the
 power drain for the heaters and increase the thermal gradients
 inside the unit, likely degrading thermal stability.

 Poul-Henning


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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Chuck Harris

Hi Leigh,

I just looked at a manual for an EGG Rb standard module, and their spec
is for -55C ambient to +68C baseplate.  They had another spec that said
MTBF 90,000 hours at 40C baseplate.  Your FEI unit probably has a similarly
worded spec.

To me this means that the ideal (expected) temperature for the baseplate is 40C.

If you are intending to operate your Rb block in a home environment, that
has conditioned air, you can assume that the ambient temperature will be
nominally 25C.  I would start from that point, simply attach the
block to the chassis, and measure the operating temperature of the baseplate.
If it is around 40C, great!  If it is much above 40C, you might want to add a
heatsink.

I wouldn't go out of my way to get below 40C.

You can calculate the heatsink size knowing only the ambient temperature,
and the power demand of the Rb block.  But for operation in a civilized
area, it is easier just to try a simple experiment.

-Chuck Harris

Leigh L. Klotz, Jr WA5ZNU wrote:

Chuck,
This device is a pull from a larger system, probably a cell site.  It's 
clearly designed to be mounted on something, as it has lots and lots of 
holes around the edge.  I suspect there's some thermal management that's 
missing.  The FEI sheet gives typical data for the 0-50C range, though 
presumably that's ambient temperature.
I don't want to cool the physics package per se, but I do want to at 
least approximate what kind of thermal solution ought to be supplied.


Quite a few of these have been sold, and I've gotten good advice from 
others on this list about calibration.  I'd hoped that someone would 
have experience with the thermal management.


So far I've seen 
http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf 


which shows (but doesn't describe) a heat sink on the bottom.

Leigh.


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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Rex

Leigh L. Klotz, Jr WA5ZNU wrote:


Chuck,
This device is a pull from a larger system, probably a cell site.  
It's clearly designed to be mounted on something, as it has lots and 
lots of holes around the edge.  I suspect there's some thermal 
management that's missing.  The FEI sheet gives typical data for the 
0-50C range, though presumably that's ambient temperature.
I don't want to cool the physics package per se, but I do want to at 
least approximate what kind of thermal solution ought to be supplied.



Several years back I bought a 5680A and mine came still mounted on the 
original (Lucent?) circuit board. There is a small amount of circuitry 
on one end, but most of the large board is just a solid plated area 
where the FE-5680A mounts. This is almost 100 in^2 plated on both sides, 
so an equivalent would be a sheet of aluminum about 7.25 x 13.5 inches. 
I'll let someone else translate that to an appropriate finned heatsink.




Quite a few of these have been sold, and I've gotten good advice from 
others on this list about calibration.  I'd hoped that someone would 
have experience with the thermal management.


So far I've seen 
http://www.dd1us.de/Downloads/precise%20reference%20frequency%20rev%200_4.pdf 


which shows (but doesn't describe) a heat sink on the bottom.

Leigh.



I never saw that particular pdf article before. It looks interesting. 
The 5680A I got was a bit different from most and I never found a way to 
program mine. I'll have to revisit the unit and see if the header 
connector he used works. I though I looked at that, but it has been a 
long time. Worth another attempt, I guess.


-Rex, kk6mk


I'm puzzled.  I admit that I don't have a lot of experience with
Rb standards, but I do have a bit of experience with the HP-5065A
Rb standard.

In the 5065A, the entire physics package is enclosed in an oven.

Assuming that your Rb is the same, and I believe it is, your plan
to force the physics package to run at room temperature is just going
to make the oven work harder in its never ending quest to maintain
stable temperature.  If you monitor the current draw of the 5680A,
you will probably see that it goes up when you put a fan on it.

Sometimes, you just have to let electronics run hot.

What did the manufacturer suggest?

-Chuck Harris

Leigh L. Klotz, Jr WA5ZNU wrote:

I've attached an SMA connector to my FE-5680A and built an external 
linear power supply with a TO-3 7815.


I ran the device today for about half an hour, and used an infrared 
sensing thermometer to measure the external case temperature.

It got up to 48 C externally in the physics package area.
I put a muffin fan on top and it brought it down to 38C but I don't 
think this is a good plan because I worry about the effects of the 
fan's magnetic field on the Rubidium system.
I found in my junk box a finned Aluminum heat sink that's exactly 
the same size as the FE-5680A and plan to tap it around the edges 
for 4-40 hardware to attach to the many screw holes.  Even so, this 
heat sink will be on the bottom, so the FE-5680A will have to be 
operated upside down for this to help.


Has anybody got good thermal management solution for this device?  
This is the one currently selling on eBay in the 25x88x125mm chassis.


Thanks,
Leigh.





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[time-nuts] FE-5680A heat sink

2009-06-08 Thread Mark Sims


Also see my post from June of last year where I had measured the heat sink rise 
over ambient of several rubidium oscillators in free air...  the FEI-5650 was 
very close to it's operating limit if operated in free air and not attached to 
something:
http://www.febo.com/pipermail/time-nuts/2008-June/031695.html

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Re: [time-nuts] FE-5680A heat sink

2009-06-08 Thread Neville Michie

Hi,
some light might be shed on the heatsink problem by reading the data  
sheet for the LPRO 101 (Symmetricom)

The units will have similar issues to cope with.
The LPRO has temperature controlled lamp and filter, at different  
temperatures above 80C.
Its power consumption is shown in a chart and is reduced as the  
temperature rises because the heating power needed becomes less.
It must have a 17V internal series regulator, because total power  
consumption falls down to the minimum of 18V.
MTBF is listed as 380kh at 20C, 320kh at 30C, 253kh at 40C, 189k at  
50C and 134k at 60C.

These are values that you would expect for most solid state boards.
My solution was to put the device onto a finned heat sink in an  
aluminum box with a tiny 12V brushless fan, (40mm)
which runs on 8 volts and is switched by a thermistor in the heatsink  
to keep the baseplate at 40C.
This seems to be a good trade-off with MTBF, and the 10 MHZ xtal will  
run at a constant temperature of 40C + or - 0.05.
I have not yet assembled the gear to measure how much its performance  
is improved.

cheers, Neville Michie


On 09/06/2009, at 2:18 PM, Mark Sims wrote:




Also see my post from June of last year where I had measured the  
heat sink rise over ambient of several rubidium oscillators in free  
air...  the FEI-5650 was very close to it's operating limit if  
operated in free air and not attached to something:

http://www.febo.com/pipermail/time-nuts/2008-June/031695.html

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