Re: [PATCH 08/14] powercap/intel_rapl: Support multi-die/package

2019-04-07 Thread Zhang Rui
On δΊ”, 2019-04-05 at 20:27 +0200, Thomas Gleixner wrote: > On Tue, 26 Feb 2019, Len Brown wrote: > > > > > From: Zhang Rui > > > > On the new dual-die/package systems, the RAPL MSR becomes die- > > scope. > > Thus instead of one powercap device per physical package, now there > > should be one

Re: [PATCH 08/14] powercap/intel_rapl: Support multi-die/package

2019-04-05 Thread Thomas Gleixner
On Tue, 26 Feb 2019, Len Brown wrote: > From: Zhang Rui > > On the new dual-die/package systems, the RAPL MSR becomes die-scope. > Thus instead of one powercap device per physical package, now there > should be one powercap device for each unique die on these systems. > > This patch introduces

[PATCH 08/14] powercap/intel_rapl: Support multi-die/package

2019-02-25 Thread Len Brown
From: Zhang Rui On the new dual-die/package systems, the RAPL MSR becomes die-scope. Thus instead of one powercap device per physical package, now there should be one powercap device for each unique die on these systems. This patch introduces intel_rapl driver support for new dual-die/package