On δΊ”, 2019-04-05 at 20:27 +0200, Thomas Gleixner wrote:
> On Tue, 26 Feb 2019, Len Brown wrote:
>
> >
> > From: Zhang Rui
> >
> > On the new dual-die/package systems, the RAPL MSR becomes die-
> > scope.
> > Thus instead of one powercap device per physical package, now there
> > should be one
On Tue, 26 Feb 2019, Len Brown wrote:
> From: Zhang Rui
>
> On the new dual-die/package systems, the RAPL MSR becomes die-scope.
> Thus instead of one powercap device per physical package, now there
> should be one powercap device for each unique die on these systems.
>
> This patch introduces
From: Zhang Rui
On the new dual-die/package systems, the RAPL MSR becomes die-scope.
Thus instead of one powercap device per physical package, now there
should be one powercap device for each unique die on these systems.
This patch introduces intel_rapl driver support for new
dual-die/package
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