Axil,

Deposit Ni by vacuum evaporation from a suspension of same in light hydrocarbon. See:
http://www.mail-archive.com/vortex-l%40eskimo.com/msg64616.html
Coat the Cu in the plate exchanger.

Warm Regards,

Reliable

Axil Axil wrote:

Stabilizing the E-Cat

It is a common belief among knowledgeable cold fusion pundits that both Rossi and DGT face challenges in controlling the reactions in their reactors. One important reason for this is process variation.

Naturally occurring variations in the physical properties of the materials that are responsive to the reaction may vary widely. These physical variations will produce corresponding variability in the reaction produced by the various ranges in material composition.

This range of variation in the material will reduce both the performance and controllability of the material based on how widely the variation deviates from the optimum specification regardless whether this variance falls below or rises above that specification.

Specifically for E-Cat micro powder, isotopic content, particle size and shape, inter-particle contact points between each particle or sets of particles, hydrogen flow patterns around particles, and hydrogen based particle heat transfer dynamics may all be important material variation parameters.

Prefabrication, characterization and testing of subunits are all important enablers of quality control and optimization through standardization.

The experience in process control gleaned from the semiconductor industry teach how designers using process control modalities run tens to thousands of simulations to analyze how the outputs of a circuit will behave according to the measured variability of the transistors for that standardization process. The measured criteria for transistors are recorded in model files given to designers for simulating their circuits before simulation.

In this semiconductor example, if the variance causes the measured or simulated performance of a particular output metric (bandwidth, gain, rise time, etc.) to fall below or rise above the specification for the particular circuit or device it reduces the overall yield for that set of devices.

One possible design approach is to stabilize the micro-powder onto a substrate to make the material more like a transistor.

Weld the micro-powder onto a nickel nanowire of thin film to stabilize each particle’s mechanical contact environment. This enables each wire to be tested reliably against a specification. Then sets of wires typified by a common performance profile can be grouped and configured in a thermal circuit driven by precise computer control.

In common service: Axil


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