On Sun, Dec 17, 2017 at 11:20 PM, Luke Kenneth Casson Leighton <[email protected]> wrote: > On Mon, Dec 18, 2017 at 6:03 AM, Richard Wilbur > <[email protected]> wrote: > >> So it might be easier to just put a ground keepout on layer 2 under >> the ESD component on layer 1 and a corresponding ground fill on layer >> 3. Likewise a ground keepout on layer 5 under the ESD component(s) on >> layer 6 and a corresponding ground fill on layer 4. > > yehyeh. ah.... do you mean the *whole* component? conflicts with > putting keepout(s) under individual pads... > >> I was recommending just under the ESD pads specifically for the >> high-frequency differential signals. > > conflicts with words above about "GND keepout under ESD components"...
Sorry for the misunderstanding. I wasn't very clear about delineating the difference between two options for dealing with the ESD component pads. 1. Ground keepout under whole ESD component(s) on adjacent reference ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6), ground fill on deeper layer (layer 3 for ESD on layer 1, layer 4 for ESD on layer 6). Ground fills connected as always using vias (some probably already adjacent). 2. Ground keepouts under just high-frequency signal pads of ESD components on adjacent reference ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6). Clear as mud? _______________________________________________ arm-netbook mailing list [email protected] http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to [email protected]
