On Mon, Dec 18, 2017 at 6:31 AM, Richard Wilbur <[email protected]> wrote:
> Sorry for the misunderstanding. I wasn't very clear about delineating > the difference between two options for dealing with the ESD component > pads. i was wondering which one to deploy. > 1. Ground keepout under whole ESD component(s) on adjacent reference > ground plane (layer 2 for ESD on layer 1, layer 5 for ESD on layer 6), > ground fill on deeper layer (layer 3 for ESD on layer 1, layer 4 for > ESD on layer 6). Ground fills connected as always using vias (some > probably already adjacent). > 2. Ground keepouts under just high-frequency signal pads of ESD > components on adjacent reference ground plane (layer 2 for ESD on > layer 1, layer 5 for ESD on layer 6). > > Clear as mud? clear... except which one to actually deploy :) l. _______________________________________________ arm-netbook mailing list [email protected] http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to [email protected]
