For LOC vs LOCR, at least those are two different machine formats. I can understand the mask being placed differently in different machine formats.
In some cases I noticed that newer instructions (e.g., the "on condition" additions from the Load/store-on-condition facility 1/2 that use machine format RSY-b) use a different HLASM operand order than earlier RSY-b format instructions. The newer on-condition instructions use HLASM order 1,2,3 while the earlier ones (like ICMH/ICMY/STCMH/STCMY) use HLASM order 1,3,2 and the machine operand order is 1,3,2. Peter -----Original Message----- From: IBM Mainframe Assembler List [mailto:[email protected]] On Behalf Of [email protected] Sent: Friday, March 27, 2015 5:40 AM To: [email protected] Subject: Re: HLASM operand order vs. instruction operand order I do have the same curiosity- (I did notice the mask jumping from left to right nibble even within one family, see LOC vs LOCR) . Dan Greiner's answer was: no specific reason. -- This message and any attachments are intended only for the use of the addressee and may contain information that is privileged and confidential. If the reader of the message is not the intended recipient or an authorized representative of the intended recipient, you are hereby notified that any dissemination of this communication is strictly prohibited. If you have received this communication in error, please notify us immediately by e-mail and delete the message and any attachments from your system.
