Does anybody have any info or sources on initial burn-in testing of electronic products. For example, I have a prototype product consisting of an embedded MCU and some digital and analog I/O. I would like to develop a burn in procedure. Should it be done at room temp. or at an elevated temp ? If anyone has any expertise in this area I would really appreciate some advice on where I could find this type of information.
A Google search turned up many contract manufacturing services, but no specific procedural information. Thanks, Jeff -- Author: Jeff McKnight INET: [EMAIL PROTECTED] Fat City Network Services -- (858) 538-5051 FAX: (858) 538-5051 San Diego, California -- Public Internet access / Mailing Lists -------------------------------------------------------------------- To REMOVE yourself from this mailing list, send an E-Mail message to: [EMAIL PROTECTED] (note EXACT spelling of 'ListGuru') and in the message BODY, include a line containing: UNSUB CHIPDIR-L (or the name of mailing list you want to be removed from). You may also send the HELP command for other information (like subscribing).
