Hi All I am designing the heat sink for the Motorola processor with bga package. Actually I got stuck at the parameter of the thermal lead resistance of the package. I would like to know whether this resistance will increase the temperature due to the power dissipation or it will decrease the temperature due to no of contacts through the balls with the pcb.
According to me the temperature will increase. Please guide me in this regard or can anybody will tell me the website where I can get the information regarding this. Regards, Girish R. Ghanekar -- Author: Ghanekar, Girish (IE03x) INET: [EMAIL PROTECTED] Fat City Network Services -- 858-538-5051 http://www.fatcity.com San Diego, California -- Mailing list and web hosting services --------------------------------------------------------------------- To REMOVE yourself from this mailing list, send an E-Mail message to: [EMAIL PROTECTED] (note EXACT spelling of 'ListGuru') and in the message BODY, include a line containing: UNSUB CHIPDIR-L (or the name of mailing list you want to be removed from). You may also send the HELP command for other information (like subscribing).
