In the past 9 days I've found that 3 of our Catalyst 6500 WS-X67xx cards (2
WS-X6748-GE-TX & 1 WS-X6748-SFP) had dislodged heat fins. The fins are
supposed to be tethered by a spring hooked into a small wire loop which seems
to be soldered onto the circuit board. In the case at hand the wire loop
pulls out of the board & the heat fin then flops around free & in 1 case the
wire loop was rattling around on the card. Not good.
I'm trying to determine if this is a systemic problem or just a fluke. It
seems like a design flaw, with the spring being too much for the soldered
wire loop. Has anybody else seen this? If so, with how many cards & of what
types?
It sounds like a design flaw. The spring force on the loop is upward.
Heat from the chip is conducted to the fins, the spring, and the loop
which softens the solder. Tension on the loop pulls it out.
They probably need to come up with a different means of attaching the
loop, maybe a stamped part with a base on the underside of the board, or
at the least use a high-melting-point solder for that attachment point.
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Jay Hennigan - CCIE #7880 - Network Engineering - j...@impulse.net
Impulse Internet Service - http://www.impulse.net/
Your local telephone and internet company - 805 884-6323 - WB6RDV
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