Monday June 1 4:00 - 4:50 PM Kelley 1001
Dr. Paul L. Bergstrom Associate Professor Electrical and Computer Engineering Michigan Technological University, Houghton, MI Porous Silicon: An Enabling Material for Microsystem Integration This presentation will explore how porous materials, and porous silicon in particular, may be utilized in many microsystem applications that benefit society. An exploration of the processes and fabrication technologies required to utilize porous silicon in applications will be presented through an overview of the porous silicon research underway at Michigan Technological University in Dr. Bergstrom's research group. The seminar will present the formation of porous silicon by electrochemical anodization and process control parameters impacting the morphology of the resulting material. Nanoporous, mesoporous, and macro porous silicon in various orientations will be presented. Applications under current investigation will be considered, including submicron particulate filtration, reference evaporation and adsorption preconcentration sources developed for the Environmental Monitoring Testbed under the NSF Engineering Research Center for Wireless Integrated Microsystems, microfluidic devices, chemical and biological sensing, and other micro electro mechanical system (MEMS) devices based on a variety of porous silicon morphologies. Biography: Dr. Paul L. Bergstrom has been actively involved in developing micro electro mechanical systems (MEMS) technologies and devices since 1987. His doctoral research with Dr. Kensall D. Wise at the University of Michigan defined a new gas sensor technology for industrial process control. From 1996 to 2000 he conducted research with Motorola's Sensor Products Division in Phoenix, Arizona, developing technologies for automotive and industrial sensors and actuators. He joined the Electrical and Computer Engineering faculty at Michigan Tech. in 2000. He is actively pursuing interdisciplinary research in novel materials, technologies, and devices for micro- and nanoscaled electronic and sensor applications. He has authored or coauthored over seventy scientific articles, two book chapters, and holds 8 patents with 10 pending. He is a member of the IEEE, ECS, and ASEE.
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