On 6/12/07, Rod Whitby <[EMAIL PROTECTED]> wrote:
OpenMoko (the registered organisation, separate from FIC the company who is creating the first piece of hardware designed for the OpenMoko software) never promised open hardware. They promised open software (the OpenMoko software, which is being developed *completely* in the open), and they gave some dates that they *expected* (not promised) FIC (the hardware company) to be ready to sell some hardware (the Neo1973) that the OpenMoko software runs on.
Yes, most of the hardware designs and schematics aren't distributed, but there are shadows of scraps here and there thanks to Werner ( http://svn.openmoko.org/developers/werner/usb-pullup/new.spice ). The Neo appears to be a well-assembled collection of chips and parts not designed or fabbed by FIC. They took some Legos and made a remarkable product. It's like a capstone design project on steriods. Given that this phone is meant to be opened and tinkered with, I imagine that schematics could be drafted without too much strain. The phone could then be //conceivably// reproduced. However, I don't know at this point how valuable open hardware would to an individual be since silicon and copper aren't that easily modified or produced at home. Quality surface-mount soldering and RF noise are just a few of the smaller hurldes to jump over. Software has the advantage for now :-) Those simple text files are just too easy to change! Until we get our own fab-labs, Joe _______________________________________________ OpenMoko community mailing list [email protected] http://lists.openmoko.org/mailman/listinfo/community
