I believe the real issue is that retooling (changing the phone
enclosure) is extremely expensive. So it's not adding the connector,
it's modifying the case to fit.

Also, do we know that they're modifying the motherboard to add extra
features for the public release, or are there simply spaces left on
the current one for the additional parts?

-Nick

On 7/2/07, Frederic Kettelhoit <[EMAIL PROTECTED]> wrote:
But there is a redesign of the board for the accelerometers, the wifi, and
the 3D Accleration. It would not be much more work to put a connector under
the top case. So if you want to play games, you just take the top case and
the back case, remove them, take the new gaming cases, add them. The little
hole below the screen would be removed, instead of it, there would be a
d-pad. I am not a hardware engineer, but the OpenMoko project built a whole
phone, so it should be easy to add some small buttons, I think.

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