I wrote: > The layout is here: > http://downloads.qi-hardware.com/people/werner/anelok/tmp/anelok-20140601.png
New and improved version incorporating lots of suggestions and observations from Joerg Reisenweber: http://downloads.qi-hardware.com/people/werner/anelok/tmp/anelok-20140603.png The most visible ones are: - the minimum solder mask width was at the default setting of zero, sometimes producing weird thin solder mask bridges. Set to 0.2 mm now. - ground fill is now much tidier after changing pad connections from "thermal relief" to "none". What this did was remove opportunities to add little ground zone snippets at lots of weird places. The latter also removed the ground zones southeast and southwest of the KL26 which turned out to be not so great ideas in the first place since they only connected to the rest of the ground system through the respective chip. Thanks, Joerg ! - Werner _______________________________________________ Qi Hardware Discussion List Mail to list (members only): [email protected] Subscribe or Unsubscribe: http://lists.en.qi-hardware.com/mailman/listinfo/discussion
