>sidney ho!--outstanding initiative on your part, negotiating with the
>upgrade engineers like that. my vast admiration and excitement at your
>work.
>
>have you forwarded to them the blue comet/black comet studies you posted
>here? esp regarding the 'goolsbee'd' improvements to the heat sink, and
>the results as measured?

My goodness, I'm becoming a verb! =)

To be honest the idea came from Japan, and was requested work by RLF 
along with an HD upgrade. I'd prefer we use a more generic term like 
'custom copper heat sink' or something other than my name. I am just 
a good observer and willing tinkerer, with no special abilities which 
warrant becoming a verb.


>maybe they could make the upgrade a whole package, selling it with the
>specifications that the card not be installed until chuck goolsbee's
>heat sink maximizer steps be performed upon any machine it is going to
>be used in.

The issue here that I see is that I am not in any way geared up to do 
these mods in any industrial-scale operation. I am just a guy with a 
workbench, and a high level of comfort with the assembly of this 
particular powerbook.

The Interware CPU upgrade has different tolerances (it has a 
significantly lower profile) than the Apple original 603 CPU (which 
snuggled right up to the built-in heatsink, and would not even allow 
such a mod to work. I haven't even laid my hands on a Newer 240 Mhz 
upgrade, or an Apple original 240 Mhz (mighty cat) CPU. I saw the 
Newer upgrade under glass at a MacWorld Expo once, but that is all.


>make it a requirement of warrantee, in big loud obvious
>warnings on the package.
>
>maybe chuck could 'goolsbee' them up some prototypes to run their
>development tests on, with their 600MGz prototypes.
>
>see what they say to that proposal.

Again, I would suspect that any company with the engineering talent 
to produce a CPU upgrade for our beloved 2400c would also have the 
engineering talent to reproduce, and most likely *improve* on the 
modification I made to RFL's 2400c. All this supposes that they can 
match the scale of the Interware upgrade. In many ways they might be 
better off designing it to match the size and width of the Apple 
original and make direct contact with the built-in heat sink, 
obviating the requirement of a Interware style thermal gap filler.


Lastly, I sweet-talked my way into procuring some free samples of 
some pretty expensive thermal gap filler material. I only have enough 
to do maybe a dozen of these mods without having to actually buy some 
more.

--chuck 'not a verb' goolsbee



=======================================================================
"It is so easy to miss pretty trivial solutions to problems deemed
complicated.  The goal of a scientist is to find an interesting problem,
and live off it for a while.  The goal of an engineer is to evade
interesting problems :)"  -- Vadim Antonov <[EMAIL PROTECTED]> on NANOG

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