On Tue, Jun 21, 2016 at 12:11:14PM -0700, Andrew Fish wrote:
> 
> > On Jun 20, 2016, at 5:58 PM, Jordan Justen <[email protected]> 
> > wrote:
> > 
> > On 2016-06-20 17:08:58, Kinney, Michael D wrote:
> >> Jordan,
> >> 
> >> There is a "Driver" directory in the proposal and the types of 
> >> components you refer to would go into packages under "Driver".
> >> 
> >> An OS does not need to initialize the CPU/Chipset/Memory/SoC
> >> from reset.  These are actions that are either done by HW
> >> or firmware, which is why I am proposing a different top level
> >> directory for modules that perform this basic init actions.
> >> 
> >> What name do you suggest as an alternative to Silicon.
> > 
> > Driver. I don't see an important reason to create a separate area for
> > these driver packages. It just appears to be causing us to invent some
> > new term, when driver works better.
> > 
> > I thought we should just make a single DriverPkg, and put all the
> > drivers under that.
> > 
> 
> Drivers, you mean like taxi drivers, and truck drivers :).
> 
> It kind of seems like Mike is making a PI Drivers bucket and a UEFI
> Drivers bucket. From an OS perspective most things work more like an
> UEFI driver. I'm not sure if using the PI and UEFI tags are going to
> help or hurt. Maybe PlatformDriverPkg and UefiDriverPkg? Not trying
> to say that is right, but I wanted to keep the conversation moving.

I like this suggestion very much, and if I was to provide some
bikeshedding it would only be in a more generic way - asking whether
the "Pkg" suffix is needed on new directories no longer treated as
individual IP-silos?

Regards,

Leif

> Thanks,
> 
> Andrew Fish
> 
> > -Jordan
> > 
> >> 
> >>> -----Original Message-----
> >>> From: Justen, Jordan L
> >>> Sent: Monday, June 20, 2016 4:55 PM
> >>> To: Mudusuru, Giri P <[email protected]>; Kinney, Michael D
> >>> <[email protected]>; [email protected]; Kinney, Michael D
> >>> <[email protected]>
> >>> Cc: Mudusuru, Giri P <[email protected]>
> >>> Subject: RE: [edk2] [RFC V2] Proposal to organize packages into 
> >>> directories
> >>> 
> >>> On 2016-06-17 15:58:38, Mudusuru, Giri P wrote:
> >>>> Thanks Mike. My preference is Silicon as it is generic and
> >>>> represents broadly CPU/Memory/Chipset/SoC etc...
> >>>> 
> >>> 
> >>> I believe Silicon can be used to manufacture other items as well. And,
> >>> it is possible to manufacture electronics without it being based on
> >>> Silicon.
> >>> 
> >>> I prefer how Linux just has a drivers directory with functional areas
> >>> split under there:
> >>> 
> >>> https://git.kernel.org/cgit/linux/kernel/git/torvalds/linux.git/tree/drivers
> >>> 
> >>> -Jordan
> >>> 
> >>>> 
> >>>>> -----Original Message-----
> >>>>> From: edk2-devel [mailto:[email protected]] On Behalf Of
> >>>>> Kinney, Michael D
> >>>>> Sent: Friday, June 17, 2016 10:50 AM
> >>>>> To: Justen, Jordan L <[email protected]>; 
> >>>>> [email protected];
> >>>>> Kinney, Michael D <[email protected]>
> >>>>> Subject: Re: [edk2] [RFC V2] Proposal to organize packages into 
> >>>>> directories
> >>>>> 
> >>>>> Hi Jordan,
> >>>>> 
> >>>>> Yes.  Many terms were considered other than Silicon, except Carbon :)
> >>>>> 
> >>>>> None of the terms we have considered are a perfect match.
> >>>>> 
> >>>>> We are wanting to keep modules for controllers attached to I/O 
> >>>>> subsystems
> >>>>> and modules for peripherals separate from modules that perform basic
> >>>>> CPU/Memory/Chipset/SoC init.
> >>>>> 
> >>>>> Is there any preference on the list between Silicon, Chip, or Device
> >>>>> or other names for basic CPU/Memory/Chipset/SoC init?
> >>>>> 
> >>>>> Thanks,
> >>>>> 
> >>>>> Mike
> >>>>> 
> >>>>> 
> >>>>>> -----Original Message-----
> >>>>>> From: edk2-devel [mailto:[email protected]] On Behalf Of
> >>>>> Jordan Justen
> >>>>>> Sent: Wednesday, June 1, 2016 1:07 PM
> >>>>>> To: Kinney, Michael D <[email protected]>; edk2-
> >>>>> [email protected]; Kinney,
> >>>>>> Michael D <[email protected]>
> >>>>>> Subject: Re: [edk2] [RFC V2] Proposal to organize packages into 
> >>>>>> directories
> >>>>>> 
> >>>>>> On 2016-05-25 19:03:38, Kinney, Michael D wrote:
> >>>>>>> # Top Level Directory Structure (Listed Alphabetically)
> >>>>>>> ```
> >>>>>>> edk2
> >>>>>>>  Application       Applications and application support libraries
> >>>>>>>  BaseTools         EDK II build tools/scripts
> >>>>>>>  Conf              EDK II build configuration files
> >>>>>>>  Core              Platform agnostic packages for core FW services
> >>>>>>>  Deprecated        Packages that will be removed from edk2/master soon
> >>>>>>>  Driver            EDK II Drivers (no platform assumptions)
> >>>>>>>    <Package1>      Non-Vendor specific EDK II drivers
> >>>>>>>    <Package2>      Non-Vendor specific EDK II drivers
> >>>>>>>    . . .
> >>>>>>>    Vendor          Vendor specific EDK II drivers
> >>>>>>>      <VendorA>
> >>>>>>>      <VendorB>
> >>>>>>>  Platform          Platforms used to validate edk2/master features
> >>>>>>>    Common          Non-vendor specific platform packages
> >>>>>>>    Emulated        Non-vendor specific emulated platform packages
> >>>>>>>    Arm             ARM specific platform packages
> >>>>>>>    Intel           Intel specific platform packages
> >>>>>>>    <VendorM>       <VendorM> specific platform packages
> >>>>>>>    <VendorN>       <VendorN> specific platform packages
> >>>>>>>  Silicon           CPU/Chipset/SoC packages
> >>>>>> 
> >>>>>> Were any other terms considered? Chip, Device?
> >>>>>> 
> >>>>>> Carbon? ;)
> >>>>>> 
> >>>>>> -Jordan
> >>>>>> 
> >>>>>>>    Common          Non-vendor specific CPU/Chipset/SoC drivers
> >>>>>>>    Arm             Arm specific CPU/Chipset/SoC drivers
> >>>>>>>    Intel           Intel specific CPU/Chipset/SoC drivers
> >>>>>>>    <VendorX>       <VendorX> specific CPU/Chipset/SoC drivers
> >>>>>>>    <VendorY>       <VendorY> specific CPU/Chipset/SoC drivers
> >>>>>>> ```
> >>>>>>> 
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