On 2016-06-17 15:58:38, Mudusuru, Giri P wrote: > Thanks Mike. My preference is Silicon as it is generic and > represents broadly CPU/Memory/Chipset/SoC etc... >
I believe Silicon can be used to manufacture other items as well. And, it is possible to manufacture electronics without it being based on Silicon. I prefer how Linux just has a drivers directory with functional areas split under there: https://git.kernel.org/cgit/linux/kernel/git/torvalds/linux.git/tree/drivers -Jordan > > > -----Original Message----- > > From: edk2-devel [mailto:[email protected]] On Behalf Of > > Kinney, Michael D > > Sent: Friday, June 17, 2016 10:50 AM > > To: Justen, Jordan L <[email protected]>; [email protected]; > > Kinney, Michael D <[email protected]> > > Subject: Re: [edk2] [RFC V2] Proposal to organize packages into directories > > > > Hi Jordan, > > > > Yes. Many terms were considered other than Silicon, except Carbon :) > > > > None of the terms we have considered are a perfect match. > > > > We are wanting to keep modules for controllers attached to I/O subsystems > > and modules for peripherals separate from modules that perform basic > > CPU/Memory/Chipset/SoC init. > > > > Is there any preference on the list between Silicon, Chip, or Device > > or other names for basic CPU/Memory/Chipset/SoC init? > > > > Thanks, > > > > Mike > > > > > > > -----Original Message----- > > > From: edk2-devel [mailto:[email protected]] On Behalf Of > > Jordan Justen > > > Sent: Wednesday, June 1, 2016 1:07 PM > > > To: Kinney, Michael D <[email protected]>; edk2- > > [email protected]; Kinney, > > > Michael D <[email protected]> > > > Subject: Re: [edk2] [RFC V2] Proposal to organize packages into > > > directories > > > > > > On 2016-05-25 19:03:38, Kinney, Michael D wrote: > > > > # Top Level Directory Structure (Listed Alphabetically) > > > > ``` > > > > edk2 > > > > Application Applications and application support libraries > > > > BaseTools EDK II build tools/scripts > > > > Conf EDK II build configuration files > > > > Core Platform agnostic packages for core FW services > > > > Deprecated Packages that will be removed from edk2/master soon > > > > Driver EDK II Drivers (no platform assumptions) > > > > <Package1> Non-Vendor specific EDK II drivers > > > > <Package2> Non-Vendor specific EDK II drivers > > > > . . . > > > > Vendor Vendor specific EDK II drivers > > > > <VendorA> > > > > <VendorB> > > > > Platform Platforms used to validate edk2/master features > > > > Common Non-vendor specific platform packages > > > > Emulated Non-vendor specific emulated platform packages > > > > Arm ARM specific platform packages > > > > Intel Intel specific platform packages > > > > <VendorM> <VendorM> specific platform packages > > > > <VendorN> <VendorN> specific platform packages > > > > Silicon CPU/Chipset/SoC packages > > > > > > Were any other terms considered? Chip, Device? > > > > > > Carbon? ;) > > > > > > -Jordan > > > > > > > Common Non-vendor specific CPU/Chipset/SoC drivers > > > > Arm Arm specific CPU/Chipset/SoC drivers > > > > Intel Intel specific CPU/Chipset/SoC drivers > > > > <VendorX> <VendorX> specific CPU/Chipset/SoC drivers > > > > <VendorY> <VendorY> specific CPU/Chipset/SoC drivers > > > > ``` > > > > > > > _______________________________________________ > > > edk2-devel mailing list > > > [email protected] > > > https://lists.01.org/mailman/listinfo/edk2-devel > > _______________________________________________ > > edk2-devel mailing list > > [email protected] > > https://lists.01.org/mailman/listinfo/edk2-devel _______________________________________________ edk2-devel mailing list [email protected] https://lists.01.org/mailman/listinfo/edk2-devel
