On Mon, Jun 18, 2012 at 2:59 PM, Guy Olinger K2AV <[email protected]>wrote:
> > Again, this conversation needs to be with the engineer. It could be an > improvement, and it could dangerous. Elecraft please weigh in. > Hi again, David, I have the following from Robert Friess, who is Elecraft's designer on this product: -------- Hi Guy, Reducing the thermal resistance to the side panel will have a negligible effect on cooling the amplifier. There are several reasons for this. Most important is that the side panel is made of steel which has a much higher thermal resistance than aluminium. Next, the internal heat sink has forced air cooling and a much larger surface area which provides much better heat exchange than convection over the side panel. Finally, the side panel is some distance from the output devices resulting in a considerable thermal gradient between the transistors and the side panel. The temperature sensor is about 1 inch from the output devices on the aluminum heatsink and tracks the case temperature of the transistors very well. I can't offer any explanation for the observed result when the thermal compound was added. It shouldn't make any difference at all. 73, Bob, N6CM ------- Perhaps your reassembly of various items fixed a current path somewhere, something mechanical? Your results did seem strange to me from the onset. Glad yours is working correctly now. 73, Guy. ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[email protected] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html
