Ok, thanks Don.

I feel kind of guilty because seems like I should have a bunch more
questions. But I'm just not having that much trouble so far. even grounding
the crystal cans went pretty smoothly hi hi once I read all the suggestions
on how to do it (tin the cans first! Then hold the ground leads in place by
putting a spare anti-static pad leftover from the IC's under the board and
sticking them into it through the grounding holes).

As for tinning the toroid leads, I did find that the solder blob method was
ineffective. Perhaps a 700F tip just doesn't get hot enough to melt the
insulation? Instead, I'm sanding the leads first with a bit of sandpaper to
get the stuff mostly off then tinning. This gives a very nice tin on the
wires and good solder connection on the board.....

Is this meant to be done with an 800F or hotter tip? 

Thanks es 73,
LS
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