I am having a running debate with regards to the ESD protection properties
of those 'pink poly bags' for packaging electronic products.

It is my understanding that these 'pink poly bags' DO NOT protect the
printed circuits FROM ESD, but merely prevent the generation of static. If
the requirement is to protect the printed circuits from an ESD event, the
boards should be packaged in the metallized bags.

Can anyone clarify/confirm this??

John A. Juhasz
Product Qualification &
Compliance Engr.

Fiber Options, Inc.
80 Orville Dr. Suite 102
Bohemia, NY 11716 USA

Tel: 516-567-8320 ext. 24
Fax: 516-567-8322 


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